Global IC Advanced Packaging Equipment Market Growth 2023-2029

Global IC Advanced Packaging Equipment Market Growth 2023-2029

The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.
In order to increase circuit density and continue or surpass "Moore's Law", advanced packaging technology has become inevitable.
LPI (LP Information)' newest research report, the “IC Advanced Packaging Equipment Industry Forecast” looks at past sales and reviews total world IC Advanced Packaging Equipment sales in 2022, providing a comprehensive analysis by region and market sector of projected IC Advanced Packaging Equipment sales for 2023 through 2029. With IC Advanced Packaging Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Advanced Packaging Equipment industry.
This Insight Report provides a comprehensive analysis of the global IC Advanced Packaging Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IC Advanced Packaging Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global IC Advanced Packaging Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Advanced Packaging Equipment and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Advanced Packaging Equipment.
The global IC Advanced Packaging Equipment market size is projected to grow from US$ 6510.5 million in 2022 to US$ 12160 million in 2029; it is expected to grow at a CAGR of 12160 from 2023 to 2029.
Global IC Advanced Packaging Equipment key players include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, etc. Global top five manufacturers hold a share about 45%.
China is the largest market, with a share about 30%, followed by United States, and Southeast Asia, both have a share over 30 percent.
In terms of product, Cutting Equipment is the largest segment, with a share over 25%. And in terms of application, the largest application is Consumer Electronics, followed by Automotive Electronics, etc.
This report presents a comprehensive overview, market shares, and growth opportunities of IC Advanced Packaging Equipment market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
Cutting Equipment
Solid Crystal Devices
Welding Equipment
Testing Equipment
Other
Segmentation by application
Automotive Electronics
Consumer Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASM Pacific
Applied Material
Advantest
Kulicke&Soffa
DISCO
Tokyo Seimitsu
BESI
Hitachi
Teradyne
Hanmi
Toray Engineering
Shinkawa
COHU Semiconductor
TOWA
SUSS Microtec
Key Questions Addressed in this Report
What is the 10-year outlook for the global IC Advanced Packaging Equipment market?
What factors are driving IC Advanced Packaging Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do IC Advanced Packaging Equipment market opportunities vary by end market size?
How does IC Advanced Packaging Equipment break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.