Global Hot-Melt Based Packaging Adhesives Market Growth 2023-2029

Global Hot-Melt Based Packaging Adhesives Market Growth 2023-2029

The hot melt adhesives are defined as adhesives that melt and flow on application of heat and solidify on cooling to give a strong adhesion. They are applied in a molten state at temperatures that range from 120°C to 180°C depending on applications and materials to be bonded.
Hot-melt adhesives are composed of three main components: a high-molecular-weight polymer that provides the adhesives’ main structure and mechanical properties, a resin/tackifier that provides wetting and adhesion properties, and a plasticizer (or wax) that controls viscosity.
LPI (LP Information)' newest research report, the “Hot-Melt Based Packaging Adhesives Industry Forecast” looks at past sales and reviews total world Hot-Melt Based Packaging Adhesives sales in 2022, providing a comprehensive analysis by region and market sector of projected Hot-Melt Based Packaging Adhesives sales for 2023 through 2029. With Hot-Melt Based Packaging Adhesives sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Hot-Melt Based Packaging Adhesives industry.
This Insight Report provides a comprehensive analysis of the global Hot-Melt Based Packaging Adhesives landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Hot-Melt Based Packaging Adhesives portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Hot-Melt Based Packaging Adhesives market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Hot-Melt Based Packaging Adhesives and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Hot-Melt Based Packaging Adhesives.
The global Hot-Melt Based Packaging Adhesives market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.
In Southeast Asia, Hot-Melt Based Packaging Adhesives key players include Henkel, H. B. Fuller, Bostik (Arkema), etc. Global top three manufacturers hold a share nearly 45%.
Indonesia is the largest market, with a share over 20%, followed by Thailand, and Malaysia, both have a share about 30 percent.
In terms of product, EVA HMA is the largest segment, with a share about 45%. And in terms of application, the largest application is Case and Carton, followed by Plastic Packaging, Labeling, Line Packaging, etc.
This report presents a comprehensive overview, market shares, and growth opportunities of Hot-Melt Based Packaging Adhesives market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
EVA HMA
SBC HMA
PA HMA
APAO HMA
POE HMA
Other
Segmentation by application
Case & Carton
Plastic Packaging
Labeling
Line Packaging
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Henkel
H. B. Fuller
Bostik (Arkema)
3M
Sika
Beardow Adams
Jowat
Avery Dennison
Adtek Malaysia
Cherng Tay Technology
Star Bond (Thailand)
Makro Rekat Sekawa
Yenom
PT.MORESCO MACRO ADHESIVE
Tex Year Industries
Nan Pao
Paramelt
Key Questions Addressed in this Report
What is the 10-year outlook for the global Hot-Melt Based Packaging Adhesives market?
What factors are driving Hot-Melt Based Packaging Adhesives market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Hot-Melt Based Packaging Adhesives market opportunities vary by end market size?
How does Hot-Melt Based Packaging Adhesives break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.