Global High-Speed Board-to-Board Connectors Market Growth 2024-2030

Global High-Speed Board-to-Board Connectors Market Growth 2024-2030

Board-to-board (BTB) connectors are used to connect printed circuit boards (PCB), electronic components that contain a conductive pattern printed on the surface of the insulating base in an accurate and repeatable manner. Each terminal on a BTB connector is connected to a PCB. A BTB connector includes housing and a specific number of terminals. The terminal is made from a conductive material (mostly copper alloy), and plated to improve conductivity and antirust. Terminals transmit the current/signal between PCBs connected by BTB; the housing is made of insulating material (mostly plastic).

The global High-Speed Board-to-Board Connectors market size is projected to grow from US$ million in 2023 to US$ million in 2030; it is expected to grow at a CAGR of % from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “High-Speed Board-to-Board Connectors Industry Forecast” looks at past sales and reviews total world High-Speed Board-to-Board Connectors sales in 2023, providing a comprehensive analysis by region and market sector of projected High-Speed Board-to-Board Connectors sales for 2024 through 2030. With High-Speed Board-to-Board Connectors sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world High-Speed Board-to-Board Connectors industry.

This Insight Report provides a comprehensive analysis of the global High-Speed Board-to-Board Connectors landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on High-Speed Board-to-Board Connectors portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global High-Speed Board-to-Board Connectors market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for High-Speed Board-to-Board Connectors and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global High-Speed Board-to-Board Connectors.

North America, Europe and China are major regions produce Board-to-board Connectors in the world, accounting for more than 66% of the world. APAC dominates the global demand market for Board-to-board Connectors and the trend is anticipated to continue for a foreseeable future. APAC is expected to account for the largest share of the global Board-to-board connector market in 2017. The demand for industrial Internet of Thing is high in the APAC region with special focus on process automation. In countries such as Japan and China where the automobile market has opportunities supported by electric vehicles, the consumption of connectors is high. The APAC region is a huge hub for consumer electronics market which in turn increases the demand for connectors in this region.

This report presents a comprehensive overview, market shares, and growth opportunities of High-Speed Board-to-Board Connectors market by product type, application, key manufacturers and key regions and countries.

Segmentation by type
Below 1.00 mm
1.00 mm-2.00 mm
Above 2.00 mm

Segmentation by application
Transportation
Consumer Electronics
Communications
Industries
Military
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
TE Connectivity
Samtec
Amphenol
Molex
Fujitsu
Hirose Electric
JST
Joint Admissions Exercise (JAE)
Delphi
Harting
Foxconn
ERNI Electronics
Kyocera
Yamaichi Electronics
Advanced Interconnect
Unimicron Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global High-Speed Board-to-Board Connectors market?

What factors are driving High-Speed Board-to-Board Connectors market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do High-Speed Board-to-Board Connectors market opportunities vary by end market size?

How does High-Speed Board-to-Board Connectors break out type, application?

Please note: The report will take approximately 2 business days to prepare and deliver.