Global High Power PCB Market Growth 2024-2030

Global High Power PCB Market Growth 2024-2030


Printed circuit board refers to a printed board that forms point connections and printed components on a universal base material according to a predetermined design. PCB can realize the interconnection between electronic components, play the role of relay transmission, and is the support body of electronic components. Generally used in power conversion, electric vehicle charging systems, industrial motor drives, solar photovoltaic inverters, large server power modules, and other fields.

The global High Power PCB market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “High Power PCB Industry Forecast” looks at past sales and reviews total world High Power PCB sales in 2023, providing a comprehensive analysis by region and market sector of projected High Power PCB sales for 2024 through 2030. With High Power PCB sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world High Power PCB industry.

This Insight Report provides a comprehensive analysis of the global High Power PCB landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on High Power PCB portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global High Power PCB market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for High Power PCB and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global High Power PCB.

United States market for High Power PCB is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for High Power PCB is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for High Power PCB is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key High Power PCB players cover Unimicron(Taiwan), NCAB GROUP CORPORATION, Wonderful Technology, Shennan Circuits, Wus Printed Circuits, etc. In terms of revenue, the global two largest companies occupied for a share nearly

% in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of High Power PCB market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Single Layer PCB
Double Layer PCB
Multli-layer PCB

Segmentation by Application:
Electric Power Conversion
Electric Vehicle Charging System
Industrial Motor Drive
Solar Photovoltaic Inverter
Large-scale Server Power Module
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Unimicron(Taiwan)
NCAB GROUP CORPORATION
Wonderful Technology
Shennan Circuits
Wus Printed Circuits
Avary Holding
MEKTEC CORPORATION
TTM Technologies Inc
Compeq Manufacturing
Tripod Technology
HANNSTAR BOARD CORPORATION
Fujikura Printed Circuits Ltd.
Sumitomo Electric Printed Circuits
AT&S Austria Technologie & Systemtechnik
NIPPON MEKTRON
Flexium
Dongshan Precision Manufacturing
Hongxin Electron-tech
Bomin Electronics
Guangdong Ellington Electronic
China Eagle Electronic Technology
Camelot Electronics Technology
Sun&Lynn Circuits
Victory Giant Technology
SI FLEX
ISU PETASYS
Yougn Poong Electronic
Daeduck Electronics

Key Questions Addressed in this Report

What is the 10-year outlook for the global High Power PCB market?

What factors are driving High Power PCB market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do High Power PCB market opportunities vary by end market size?

How does High Power PCB break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.


*This is a tentative TOC and the final deliverable is subject to change.*
1 Scope of the Report
2 Executive Summary
3 Global by Company
4 World Historic Review for High Power PCB by Geographic Region
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
10 Manufacturing Cost Structure Analysis
11 Marketing, Distributors and Customer
12 World Forecast Review for High Power PCB by Geographic Region
13 Key Players Analysis
14 Research Findings and Conclusion

Download our eBook: How to Succeed Using Market Research

Learn how to effectively navigate the market research process to help guide your organization on the journey to success.

Download eBook
Cookie Settings