Global High Bandwidth Memory for AI Market Growth (Status and Outlook) 2025-2031

The global High Bandwidth Memory for AI market size is predicted to grow from US$ 21390 million in 2025 to US$ 55790 million in 2031; it is expected to grow at a CAGR of 17.3% from 2025 to 2031.

High Bandwidth Memory (HBM) for AI is a type of advanced DRAM specifically designed to provide high-speed data access and exceptional memory bandwidth for artificial intelligence (AI) applications. It is integrated directly onto the same package as the processor (e.g., GPU, CPU, or AI accelerator), enabling faster communication and lower latency compared to traditional memory types. HBM supports demanding AI workloads, such as deep learning model training, natural language processing, and real-time inference, by offering efficient data handling and reduced power consumption. Its compact stacked architecture allows for high capacity and performance while minimizing space usage in AI hardware systems.

United States market for High Bandwidth Memory for AI is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for High Bandwidth Memory for AI is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for High Bandwidth Memory for AI is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key High Bandwidth Memory for AI players cover SK Hynix, Micron Technology Inc., Intel, Samsung, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LPI (LP Information)' newest research report, the “High Bandwidth Memory for AI Industry Forecast” looks at past sales and reviews total world High Bandwidth Memory for AI sales in 2024, providing a comprehensive analysis by region and market sector of projected High Bandwidth Memory for AI sales for 2025 through 2031. With High Bandwidth Memory for AI sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world High Bandwidth Memory for AI industry.

This Insight Report provides a comprehensive analysis of the global High Bandwidth Memory for AI landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on High Bandwidth Memory for AI portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global High Bandwidth Memory for AI market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for High Bandwidth Memory for AI and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global High Bandwidth Memory for AI.

This report presents a comprehensive overview, market shares, and growth opportunities of High Bandwidth Memory for AI market by product type, application, key players and key regions and countries.

Segmentation by Type:
HBM (First Generation)
HBM (Second Generation)
Others

Segmentation by Application:
Deep Learning Model Training
Inference in AI Systems
High-Performance Computing (HPC) in AI
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
SK Hynix
Micron Technology Inc.
Intel
Samsung

Please note: The report will take approximately 2 business days to prepare and deliver.