Global Hard Chemical-Mechanical Polishing (CMP) Pad Market Growth 2025-2031
The global Hard Chemical-Mechanical Polishing (CMP) Pad market size is predicted to grow from US$ 710 million in 2025 to US$ 890 million in 2031; it is expected to grow at a CAGR of 3.8% from 2025 to 2031.
CMP Pad (Chemical Mechanical Polishing Pad) is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes. CMP Pad can be divided Hard CMP Pad and Soft CMP Pad. As for Hard CMP Pad, its base material is polyurethane.
Hard Chemical-Mechanical Polishing (CMP) Pad market has several key players, like DuPont, FUJIBO, and CMC Materials with market share 95.01% in value. Global giant manufactures mainly distributed in USA, Japan and Taiwan. It has unshakable status in this field.
China Taiwan is the largest consumption region of hard CMP Pads, with a consumption market share nearly 22.00% in 2019. The second place is South Korea; following China Taiwan with the consumption market share over 21.38% in 2019.
LP Information, Inc. (LPI) ' newest research report, the “Hard Chemical-Mechanical Polishing (CMP) Pad Industry Forecast” looks at past sales and reviews total world Hard Chemical-Mechanical Polishing (CMP) Pad sales in 2024, providing a comprehensive analysis by region and market sector of projected Hard Chemical-Mechanical Polishing (CMP) Pad sales for 2025 through 2031. With Hard Chemical-Mechanical Polishing (CMP) Pad sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Hard Chemical-Mechanical Polishing (CMP) Pad industry.
This Insight Report provides a comprehensive analysis of the global Hard Chemical-Mechanical Polishing (CMP) Pad landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Hard Chemical-Mechanical Polishing (CMP) Pad portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Hard Chemical-Mechanical Polishing (CMP) Pad market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Hard Chemical-Mechanical Polishing (CMP) Pad and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Hard Chemical-Mechanical Polishing (CMP) Pad.
This report presents a comprehensive overview, market shares, and growth opportunities of Hard Chemical-Mechanical Polishing (CMP) Pad market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Polyurethane CMP Pads
Other Materials
Segmentation by Application:
300mm Wafer
200mm Wafer
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DuPont
CMC Materials, Inc.
FOJIBO
TWI Incorporated
Hubei Dinglong Co.,Ltd
FNS TECH Co., LTD
3M
SKC
IV Technologies Co., Ltd.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Hard Chemical-Mechanical Polishing (CMP) Pad market?
What factors are driving Hard Chemical-Mechanical Polishing (CMP) Pad market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Hard Chemical-Mechanical Polishing (CMP) Pad market opportunities vary by end market size?
How does Hard Chemical-Mechanical Polishing (CMP) Pad break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.