Global HBM2 DRAM Market Growth 2025-2031

The global HBM2 DRAM market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

HBM2 is the second generation of High Bandwidth Memory that greatly improved upon the key features of its predecessor – it offered twice the bandwidth (256 GB/s) per die and a single die could support up to 8 GB of memory, plus it allowed for 8-die stacks, thus greatly increasing the overall performance potential of HBM2 compared to its predecessor.

United States market for HBM2 DRAM is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for HBM2 DRAM is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for HBM2 DRAM is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key HBM2 DRAM players cover SK Hynix, Samsung, Micron, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “HBM2 DRAM Industry Forecast” looks at past sales and reviews total world HBM2 DRAM sales in 2024, providing a comprehensive analysis by region and market sector of projected HBM2 DRAM sales for 2025 through 2031. With HBM2 DRAM sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world HBM2 DRAM industry.

This Insight Report provides a comprehensive analysis of the global HBM2 DRAM landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on HBM2 DRAM portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global HBM2 DRAM market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for HBM2 DRAM and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global HBM2 DRAM.

This report presents a comprehensive overview, market shares, and growth opportunities of HBM2 DRAM market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
4 G
8 G
16 G
Others

Segmentation by Application:
Servers
Networking
Consumer
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
SK Hynix
Samsung
Micron

Key Questions Addressed in this Report

What is the 10-year outlook for the global HBM2 DRAM market?

What factors are driving HBM2 DRAM market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do HBM2 DRAM market opportunities vary by end market size?

How does HBM2 DRAM break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.