Global Through Glass Via (TGV) Wafer Market Growth (Status and Outlook) 2025-2031

Global Through Glass Via (TGV) Wafer Market Growth (Status and Outlook) 2025-2031

The global Through Glass Via (TGV) Wafer market size is predicted to grow from US$ 100 million in 2025 to US$ 693 million in 2031; it is expected to grow at a CAGR of 38.1% from 2025 to 2031.

Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).

United States is the largest Through Glass Via (TGV) Wafer market with about 46% market share. Europe is follower, accounting for about 25% market share.The global market share concentration is relatively concentrated. Of the major players of the Through Glass Via (TGV) Wafer market, Corning maintained its first place in the ranking. Corning accounted for 26% of the Global Through Glass Via (TGV) Wafer Production Value market share. Other players accounted for 21%, 11% including LPKF and Samtec. The other major players in this report including Kiso Micro Co. LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia.

LPI (LP Information)' newest research report, the “Through Glass Via (TGV) Wafer Industry Forecast” looks at past sales and reviews total world Through Glass Via (TGV) Wafer sales in 2024, providing a comprehensive analysis by region and market sector of projected Through Glass Via (TGV) Wafer sales for 2025 through 2031. With Through Glass Via (TGV) Wafer sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Through Glass Via (TGV) Wafer industry.

This Insight Report provides a comprehensive analysis of the global Through Glass Via (TGV) Wafer landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Through Glass Via (TGV) Wafer portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Through Glass Via (TGV) Wafer market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Through Glass Via (TGV) Wafer and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Through Glass Via (TGV) Wafer.

This report presents a comprehensive overview, market shares, and growth opportunities of Through Glass Via (TGV) Wafer market by product type, application, key players and key regions and countries.

Segmentation by Type:
300 mm
200 mm
Below150 mm

Segmentation by Application:
Biotechnology/Medical
Consumer Electronics
Automotive
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia