Global Through Glass Via (TGV) Technology Market Growth (Status and Outlook) 2025-2031

Global Through Glass Via (TGV) Technology Market Growth (Status and Outlook) 2025-2031

The global Through Glass Via (TGV) Technology market size is predicted to grow from US$ 126 million in 2025 to US$ 432 million in 2031; it is expected to grow at a CAGR of 22.8% from 2025 to 2031.

Glass Through-Via (TGV, short for Through-Glass Via) is a miniaturization packaging technology used in semiconductor encapsulation and microelectronic devices. The TGV process enables the creation of precise through-holes (i.e., vias) in glass substrates, which are subsequently filled with conductive materials (such as metals) in subsequent processes. TGV features numerous through-holes in glass with diameters measured in micrometers, positioning it as a promising material for the next-generation semiconductor packaging substrates. High-quality TGV achieved through glass materials and hole processing technologies facilitates the miniaturization of devices in various markets, including data centers, 5G communication networks, and IoT devices, enabling high-density packaging and GHz-speed data processing.

Through-Glass Vias (TGV) represent an advanced three-dimensional integrated circuit technology, enabling device miniaturization across various sectors such as data centers, 5G communication networks, and IoT devices, in addition to facilitating high-density packaging and GHz-speed data processing. Glass emerges as a potential alternative to silicon interposers, with TGV offering advantages over Silicon Through-Vias (TSVs), including lower costs, ready availability of large-sized ultrathin glass substrates, and superior high-frequency electrical performance. Core to TGV technology lies in the deep hole formation process, with techniques like plasma etching and laser ablation having been developed for glass hole-making. Nonetheless, the fragility, smooth surface, and chemical inertness of glass materials currently hinder the mass production and widespread application of TGVs.

From a regional perspective, the Chinese market has witnessed rapid changes in recent years. In 2023, its market size stood at USD 17.86 million, constituting approximately 17.76% of the global total. By 2030, it is anticipated to reach USD 110.12 million, accounting for 25.97% of the global market. As the leading country in 5G network construction and a major producer of downstream 5G terminal equipment, China's TGV market growth surpasses the global average. Prospects for the TGV market are vast, poised for expansion with technological advancements and cost reductions.

The TGV substrate market landscape is highly concentrated, with foreign manufacturers dominating testing products and technologies. Key players include Corning, LPKF, Samtec, KISO WAVE Co., Ltd., and Tecnisco. Corning leads the global TGV substrate industry with a 24.67% market share in 2023, followed by LPKF at 22.37%, and Samtec at 9.67%. Chinese enterprises such as Xiamen Sky Semiconductor have made progress, with the former already supplying substantial quantities. However, this does not signify a clear path for Chinese companies in the TGV realm. Their future development remains to be tested by the market.

LPI (LP Information)' newest research report, the “Through Glass Via (TGV) Technology Industry Forecast” looks at past sales and reviews total world Through Glass Via (TGV) Technology sales in 2024, providing a comprehensive analysis by region and market sector of projected Through Glass Via (TGV) Technology sales for 2025 through 2031. With Through Glass Via (TGV) Technology sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Through Glass Via (TGV) Technology industry.

This Insight Report provides a comprehensive analysis of the global Through Glass Via (TGV) Technology landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Through Glass Via (TGV) Technology portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Through Glass Via (TGV) Technology market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Through Glass Via (TGV) Technology and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Through Glass Via (TGV) Technology.

This report presents a comprehensive overview, market shares, and growth opportunities of Through Glass Via (TGV) Technology market by product type, application, key players and key regions and countries.

Segmentation by Type:
300 mm
200 mm
Less Than 150 mm

Segmentation by Application:
Consumer Electronics
Automobile Industry
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Corning
LPKF
Samtec
KISO WAVE Co., Ltd.
Xiamen Sky Semiconductor
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia

Please note: The report will take approximately 2 business days to prepare and deliver.