Global Through Glass Via (TGV) Technology Market Growth (Status and Outlook) 2023-2029

Global Through Glass Via (TGV) Technology Market Growth (Status and Outlook) 2023-2029

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
LPI (LP Information)' newest research report, the “Through Glass Via (TGV) Technology Industry Forecast” looks at past sales and reviews total world Through Glass Via (TGV) Technology sales in 2022, providing a comprehensive analysis by region and market sector of projected Through Glass Via (TGV) Technology sales for 2023 through 2029. With Through Glass Via (TGV) Technology sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Through Glass Via (TGV) Technology industry.
This Insight Report provides a comprehensive analysis of the global Through Glass Via (TGV) Technology landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Through Glass Via (TGV) Technology portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Through Glass Via (TGV) Technology market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Through Glass Via (TGV) Technology and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Through Glass Via (TGV) Technology.
The global Through Glass Via (TGV) Technology market size is projected to grow from US$ 49 million in 2022 to US$ 241.5 million in 2029; it is expected to grow at a CAGR of 25.6% from 2023 to 2029.
Global Through Glass Via (TGV) Technology key players include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, etc. Global top five manufacturers hold a share over 70%.
Asia-Pacific is the largest market, with a share over 15%, followed by Europe, and North America, both have a share over 15 percent.
In terms of product, 300 mm is the largest segment, with a share over 65%. And in terms of application, the largest application is Biotechnology/Medical, followed by Consumer Electronics, etc.
This report presents a comprehensive overview, market shares, and growth opportunities of Through Glass Via (TGV) Technology market by product type, application, key players and key regions and countries.
Market Segmentation:
Segmentation by type
300 mm
200 mm
Less Than 150 mm
Segmentation by application
Biotechnology/Medical
Consumer Electronics
Automotive
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia

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