Global Glass Substrate for Semiconductor Packaging Market Growth (Status and Outlook) 2025-2031

The global Glass Substrate for Semiconductor Packaging market size is predicted to grow from US$ 209 million in 2025 to US$ 517 million in 2031; it is expected to grow at a CAGR of 16.3% from 2025 to 2031.

A glass substrate for semiconductor packaging refers to a specially designed glass material used as a base or platform for constructing and assembling electronic components, particularly semiconductors. It provides a stable and inert surface for mounting and connecting delicate semiconductor devices, such as integrated circuits (ICs), microprocessors, and memory chips. Glass substrates used in semiconductor packaging are engineered to possess specific characteristics that make them suitable for this application. These characteristics include high thermal conductivity, low coefficient of thermal expansion (CTE), electrical insulation properties, chemical resistance, and excellent dimensional stability. The glass substrate serves as a foundation for placing and interconnecting chips, allowing for the creation of complex electronic circuits. Additionally, it can provide protection against moisture, dust, and mechanical stress, enhancing the durability and reliability of the semiconductors. Compared to currently used organic substrates, glass substrates offer better thermal and mechanical stability and ultra-low flatness. These properties promote the increase in chip surface area and the number of chiplets on a single package. A dynamic that allows, in short, to improve the design rules necessary for artificial intelligence products and future data centers by an order of magnitude.

Global key players of Glass Substrate for Semiconductor Packaging include AGC, Schott, Corning, Hoya, Ohara, etc. The top five players hold a share about 90%. Asia-Pacific is the largest market, and has a share about 80%, followed by North America and Europe with share 16% and 3%, separately. In terms of product type, Coefficient of Thermal Expansion (CTE), above 5 ppm/°C is the largest segment, occupied for a share of 65%. In terms of application, Wafer Level Packaging has a share about 60 percent.

LPI (LP Information)' newest research report, the “Glass Substrate for Semiconductor Packaging Industry Forecast” looks at past sales and reviews total world Glass Substrate for Semiconductor Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Glass Substrate for Semiconductor Packaging sales for 2025 through 2031. With Glass Substrate for Semiconductor Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Glass Substrate for Semiconductor Packaging industry.

This Insight Report provides a comprehensive analysis of the global Glass Substrate for Semiconductor Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Glass Substrate for Semiconductor Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Glass Substrate for Semiconductor Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Glass Substrate for Semiconductor Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Glass Substrate for Semiconductor Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Glass Substrate for Semiconductor Packaging market by product type, application, key players and key regions and countries.

Segmentation by Type:

Coefficient of Thermal Expansion (CTE), above 5 ppm/°C

Coefficient of Thermal Expansion (CTE), below 5 ppm/°C

Segmentation by Application:

Wafer Level Packaging

Panel Level Packaging

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.

AGC

Schott

Corning

Hoya

Ohara

CrysTop Glass

WGTech

Please note: The report will take approximately 2 business days to prepare and deliver.