Global Fully Automatic Transfer Molding Equipment Market Growth 2025-2031

The global Fully Automatic Transfer Molding Equipment market size is predicted to grow from US$ 284 million in 2025 to US$ 398 million in 2031; it is expected to grow at a CAGR of 5.8% from 2025 to 2031.

Fully Automatic Transfer Molding Equipment is specialized machinery used in the semiconductor packaging process to encapsulate microchips with protective materials, such as epoxy resins. This process ensures mechanical stability, electrical insulation, and protection from environmental factors like moisture and dust.

United States market for Fully Automatic Transfer Molding Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Fully Automatic Transfer Molding Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Fully Automatic Transfer Molding Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Fully Automatic Transfer Molding Equipment players cover Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Fully Automatic Transfer Molding Equipment Industry Forecast” looks at past sales and reviews total world Fully Automatic Transfer Molding Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Fully Automatic Transfer Molding Equipment sales for 2025 through 2031. With Fully Automatic Transfer Molding Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Fully Automatic Transfer Molding Equipment industry.

This Insight Report provides a comprehensive analysis of the global Fully Automatic Transfer Molding Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Fully Automatic Transfer Molding Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Fully Automatic Transfer Molding Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Fully Automatic Transfer Molding Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Fully Automatic Transfer Molding Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Fully Automatic Transfer Molding Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Maximum 120T
Maximum 170T
Maximum 180T
Others

Segmentation by Application:
Advanced Packaging
Traditional Packaging

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Towa
Besi
ASMPT
I-PEX Inc
Tongling Trinity Technology
Shanghai Xinsheng
Mtex Matsumura
Asahi Engineering
Nextool Technology Co., Ltd.
APIC YAMADA
Suzhou Bopai Semiconductor (Boschman)
Anhui Zhonghe
NFT CO., LTD
HANMI Semiconductor
Gallant Micro Machining
Wuxi G-chip Semiconductor Technology
Jiangsu Guoxin Intelligent Equipment
Dongguan Huayue Semiconductor Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Fully Automatic Transfer Molding Equipment market?

What factors are driving Fully Automatic Transfer Molding Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Fully Automatic Transfer Molding Equipment market opportunities vary by end market size?

How does Fully Automatic Transfer Molding Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.