Global Fully Automatic Semiconductor Molding Equipment Market Growth 2025-2031

The global Fully Automatic Semiconductor Molding Equipment market size is predicted to grow from US$ 301 million in 2025 to US$ 388 million in 2031; it is expected to grow at a CAGR of 4.4% from 2025 to 2031.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

LP Information, Inc. (LPI) ' newest research report, the “Fully Automatic Semiconductor Molding Equipment Industry Forecast” looks at past sales and reviews total world Fully Automatic Semiconductor Molding Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Fully Automatic Semiconductor Molding Equipment sales for 2025 through 2031. With Fully Automatic Semiconductor Molding Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Fully Automatic Semiconductor Molding Equipment industry.

This Insight Report provides a comprehensive analysis of the global Fully Automatic Semiconductor Molding Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Fully Automatic Semiconductor Molding Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Fully Automatic Semiconductor Molding Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Fully Automatic Semiconductor Molding Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Fully Automatic Semiconductor Molding Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Fully Automatic Semiconductor Molding Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Hydraulic Semiconductor Molding System
Electric Semiconductor Molding System

Segmentation by Application:
Wafer Level Packaging
BGA Packaging
Flat Panel Packaging
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Fully Automatic Semiconductor Molding Equipment market?

What factors are driving Fully Automatic Semiconductor Molding Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Fully Automatic Semiconductor Molding Equipment market opportunities vary by end market size?

How does Fully Automatic Semiconductor Molding Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.