Global Fully Automatic Die Bonder Equipment Market Growth 2025-2031

The global Fully Automatic Die Bonder Equipment market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

Fully-automated industrial versions are for large-scale mass production. Die bonders are specialized semi- or fully-automatic high-precision machine tools used in semiconductor device fabrications. Die bonders fix the semiconductor chip, or die, to the substrate, package, or lead frame, using an adhesive glueClean room environment, eutectic material or solder. Usually the chip or die is a 25 mm square and comes in wafer trays. Die bonding machines have to be accurate down to the micron level.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

LP Information, Inc. (LPI) ' newest research report, the “Fully Automatic Die Bonder Equipment Industry Forecast” looks at past sales and reviews total world Fully Automatic Die Bonder Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Fully Automatic Die Bonder Equipment sales for 2025 through 2031. With Fully Automatic Die Bonder Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Fully Automatic Die Bonder Equipment industry.

This Insight Report provides a comprehensive analysis of the global Fully Automatic Die Bonder Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Fully Automatic Die Bonder Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Fully Automatic Die Bonder Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Fully Automatic Die Bonder Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Fully Automatic Die Bonder Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Fully Automatic Die Bonder Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Epoxy Die Bonder
Eutectic Die Bonder
Soft Solder Die Bonder
Flip Chip Die Bonder

Segmentation by Application:
Die Bonder Equipment for Integrated Device Manufacturers (DMs)
Die Bonder Equipment for Outsourced Semiconductor Assembly and Test (OSAT)

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Toray Engineering
FASFORD TECHNOLOGY
Besi
ASM Pacific Technology Limited (ASMPT)
Kulicke & Soffa Industries Inc.
Tresky AG
SHIBAURA MECHATRONICS CORPORATION
West Bond
Panasonic Corporation
MRSI Systems
SHINKAWA LTD.
Palomar Technologies
DIAS Automation

Key Questions Addressed in this Report

What is the 10-year outlook for the global Fully Automatic Die Bonder Equipment market?

What factors are driving Fully Automatic Die Bonder Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Fully Automatic Die Bonder Equipment market opportunities vary by end market size?

How does Fully Automatic Die Bonder Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.