Global Flip Chip Technology Market Growth (Status and Outlook) 2023-2029

Global Flip Chip Technology Market Growth (Status and Outlook) 2023-2029

In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.

LPI (LP Information)' newest research report, the “Flip Chip Technology Industry Forecast” looks at past sales and reviews total world Flip Chip Technology sales in 2022, providing a comprehensive analysis by region and market sector of projected Flip Chip Technology sales for 2023 through 2029. With Flip Chip Technology sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Flip Chip Technology industry.

This Insight Report provides a comprehensive analysis of the global Flip Chip Technology landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Flip Chip Technology portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Flip Chip Technology market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Flip Chip Technology and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Flip Chip Technology.

The global Flip Chip Technology market size is projected to grow from US$ 21030 million in 2022 to US$ 31650 million in 2029; it is expected to grow at a CAGR of 6.0% from 2023 to 2029.

The APAC held a large share of the overall flip chip technology market in 2017.

This report presents a comprehensive overview, market shares, and growth opportunities of Flip Chip Technology market by product type, application, key players and key regions and countries.

Market Segmentation:

Segmentation by type
Packaging Technology
Mosaic Technology
Other

Segmentation by application
Consumer electronics
Telecommunication
Automotive
Industrial sector
Medical devices
Smart technologies
Military & aerospace

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Samsung
Intel
Global Foundries
UMC
ASE
Amkor
STATS ChipPAC
Powertech
STMicroelectronics
Texas Instruments

Please note: The report will take approximately 2 business days to prepare and deliver.