Global Flip Chip Bonder Market Growth 2023-2029

Global Flip Chip Bonder Market Growth 2023-2029

Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
LPI (LP Information)' newest research report, the “Flip Chip Bonder Industry Forecast” looks at past sales and reviews total world Flip Chip Bonder sales in 2022, providing a comprehensive analysis by region and market sector of projected Flip Chip Bonder sales for 2023 through 2029. With Flip Chip Bonder sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Flip Chip Bonder industry.
This Insight Report provides a comprehensive analysis of the global Flip Chip Bonder landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Flip Chip Bonder portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Flip Chip Bonder market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Flip Chip Bonder and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Flip Chip Bonder.
The global Flip Chip Bonder market size is projected to grow from US$ 283.7 million in 2022 to US$ 309.4 million in 2029; it is expected to grow at a CAGR of 309.4 from 2023 to 2029.
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%.
China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent.
In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
This report presents a comprehensive overview, market shares, and growth opportunities of Flip Chip Bonder market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
Fully Automatic
Semi-Automatic
Segmentation by application
IDMs
OSAT
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA
Key Questions Addressed in this Report
What is the 10-year outlook for the global Flip Chip Bonder market?
What factors are driving Flip Chip Bonder market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Flip Chip Bonder market opportunities vary by end market size?
How does Flip Chip Bonder break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.