Global Fabless IC Design Market Growth (Status and Outlook) 2025-2031

The global Fabless IC Design market size is predicted to grow from US$ 253070 million in 2025 to US$ 549270 million in 2031; it is expected to grow at a CAGR of 13.8% from 2025 to 2031.

Fabless IC design refers to fabless integrated circuit design. It is a business model in which companies focus on integrated circuit design and development without their own wafer manufacturing plants. Under this model, IC design companies usually only engage in the design and sales of semiconductors, while entrusting chip manufacturing, packaging and testing to chip foundry companies. Companies that adopt the Fabless model can focus on the design and sales of semiconductors. This allows these companies to not only concentrate resources to continue technological innovation and upgrading, but also to independently select advanced process technologies and enter into long-term strategic cooperation with top-ranked chip foundries, thereby making full use of the world's advanced process manufacturing technologies and mature quality management. system. In addition, under the Fabless model, the company will have high market sensitivity, quickly respond to market hot spots and demand changes, quickly launch new products, and focus on improving market development and customer maintenance capabilities. In terms of cost, the Fabless model has a relatively smaller initial capital investment compared to the IDM model. It can give full play to its R&D strength and market development capabilities and quickly achieve large-scale benefits. This report focuses on fabless IC design, including the Analog ICs, Logic ICs, Microcontroller and Microprocessor ICs and Memory ICs.

Global key players of Fabless IC Design include NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, etc. The top five players hold a share about 71%. Asia-Pacific is the largest market, and has a share about 70%, followed by North America and Europe with share 20% and 8%, separately. In terms of product type, IC Design-Logic is the largest segment, accounting for a share of 57%. In terms of application, PCs is the largest field with a share about 29 percent.

LPI (LP Information)' newest research report, the “Fabless IC Design Industry Forecast” looks at past sales and reviews total world Fabless IC Design sales in 2024, providing a comprehensive analysis by region and market sector of projected Fabless IC Design sales for 2025 through 2031. With Fabless IC Design sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Fabless IC Design industry.

This Insight Report provides a comprehensive analysis of the global Fabless IC Design landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Fabless IC Design portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Fabless IC Design market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Fabless IC Design and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Fabless IC Design.

This report presents a comprehensive overview, market shares, and growth opportunities of Fabless IC Design market by product type, application, key players and key regions and countries.

Segmentation by Type:

Analog ICs

Logic ICs

Microcontroller and Microprocessor ICs

Memory ICs

Segmentation by Application:

Mobile Devices

PCs

Automotive

Industrial & Medical

Servers

Network Infrastructure

Appliances/Consumer Goods

Others

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.

NVIDIA

Qualcomm

Broadcom

Advanced Micro Devices, Inc. (AMD)

MediaTek

Marvell Technology Group

Novatek Microelectronics Corp.

Tsinghua Unigroup

Realtek Semiconductor Corporation

OmniVision Technology, Inc

Monolithic Power Systems, Inc. (MPS)

Cirrus Logic, Inc.

Socionext Inc.

LX Semicon

HiSilicon Technologies

Synaptics

Allegro MicroSystems

Himax Technologies

Semtech

Global Unichip Corporation (GUC)

Hygon Information Technology

GigaDevice

Silicon Motion

Ingenic Semiconductor

Raydium

Goodix Limited

Sitronix

Nordic Semiconductor

Silergy

Shanghai Fudan Microelectronics Group

Alchip Technologies

FocalTech

MegaChips Corporation

Elite Semiconductor Microelectronics Technology

SGMICRO

Please note: The report will take approximately 2 business days to prepare and deliver.