Global FPC Coverlay Market Growth 2025-2031

The global FPC Coverlay market size is predicted to grow from US$ 472 million in 2025 to US$ 703 million in 2031; it is expected to grow at a CAGR of 6.9% from 2025 to 2031.

FPC Coverlay consists of a solid sheet of polyimide with a layer of flexible adhesive. Coverlay plays the exact same function as a solder mask on rigid boards but only for flexible printed circuit boards (PCBs). Conventional solder masks have only a limited bendability, so for flex circuits that require greater bendability, coverlay is bonded (glued) on to encapsulate and protect the external copper circuit layers of a flexible printed circuit (FPC). Different from rigid PCB solder mask, coverlay is typically supplied in a roll form, sometimes in sheet and cut to size. From there, the coverlay openings needed may be drilled, routed, punched, or laser cut depending on the complexity of the flex PCB design and feature sizes. Once the pattern is created, the film is then aligned to the copper circuit layer and pressed under heat and pressure, over time, to cure the adhesive to complete the coverlay bonding.

At present, the FPC Coverlay market is in a booming stage. With the rapid development of consumer electronics, smart phones, wearable devices, automotive electronics and other fields, the demand for flexible circuit boards (FPC) is increasing, and FPC Coverlay, as a key component of FPC, is also increasing in market demand.

Globally, the Asia-Pacific region, especially China, Japan and South Korea, is the main consumer area of ​​the FPC Coverlay market. As the world's largest consumer electronics production base, China has huge market demand, especially in the fields of smart phones, tablets, wearable devices, etc. These products have a high demand for flexible circuit boards, which directly promotes the growth of the FPC Coverlay market. At the same time, the demand for high-end electronic products in the European and American markets also provides solid support for the FPC Coverlay market.

From the perspective of technical application, with the rapid development of emerging technologies such as 5G communications, the Internet of Things, and artificial intelligence, the complexity of electronic products continues to increase, especially FPC products that require higher density and high reliability. The high performance requirements of FPC Coverlay are also increasing. Modern FPC Coverlay is not only required to have good insulation performance, heat resistance, and chemical stability, but also needs to have outstanding performance in terms of wear resistance, moisture resistance, and corrosion resistance, which puts higher demands on the research and development of Coverlay materials.

Global FPC coverlay manufacturers include DuPont, Taiflex, Arisawa Mfg and INNOX Advanced Materials. The top four companies hold a share about 38%. The global origins are mainly located in North America, Europe, China, Japan, South Korea and Taiwan (China). In terms of type, black coverlay is the largest segment, with a share of about 43%. And in terms of application, the double sided (SS) FPC segment holds a share of about 81 percent.

LP Information, Inc. (LPI) ' newest research report, the “FPC Coverlay Industry Forecast” looks at past sales and reviews total world FPC Coverlay sales in 2024, providing a comprehensive analysis by region and market sector of projected FPC Coverlay sales for 2025 through 2031. With FPC Coverlay sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world FPC Coverlay industry.

This Insight Report provides a comprehensive analysis of the global FPC Coverlay landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on FPC Coverlay portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global FPC Coverlay market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for FPC Coverlay and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global FPC Coverlay.

This report presents a comprehensive overview, market shares, and growth opportunities of FPC Coverlay market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Yellow Coverlay
Black Coverlay
Others

Segmentation by Application:
Single Sided (SS) FPC
Double Sided (DS) FPC

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DuPont
Taiflex
Arisawa Mfg
INNOX Advanced Materials
ITEQ Corporation
Nikkan
SYTECH
AEM
Zhengye Technology
Hanwha Advanced Materials
Microcosm
Hongzheng Technology
Dongyi
Advance Materials Corporation

Key Questions Addressed in this Report

What is the 10-year outlook for the global FPC Coverlay market?

What factors are driving FPC Coverlay market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do FPC Coverlay market opportunities vary by end market size?

How does FPC Coverlay break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.