Global FC BGA Market Growth 2024-2030

Global FC BGA Market Growth 2024-2030

Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.

This report studies the FC BGA substrate, also called ABF (Ajinomoto Build-up Film) substrates, which are IC Substrates made of Ajinomoto Build-up Film.

The ABF (Ajinomoto Build-up Film) substrate consists of multiple layers of microcircuits, known as a “build-up substrate” which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.

The global FC BGA market size is projected to grow from US$ 5663 million in 2024 to US$ 10030 million in 2030; it is expected to grow at a CAGR of 10.0% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “FC BGA Industry Forecast” looks at past sales and reviews total world FC BGA sales in 2023, providing a comprehensive analysis by region and market sector of projected FC BGA sales for 2024 through 2030. With FC BGA sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world FC BGA industry.

This Insight Report provides a comprehensive analysis of the global FC BGA landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on FC BGA portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global FC BGA market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for FC BGA and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global FC BGA.

Global key players of ABF Substrate include Unimicron, Ibiden, AT&S, Nan Ya PCB, Shinko Electric Industries, etc. The top five players hold a share about 74%. China Taiwan is the world's largest market for ABF Substrate and holds a share about 30%, followed by China mainland and South Korea, with share about 17% and 17%, separately. In terms of product type, 4-8 Layers ABF Substrate is the largest segment, accounting for a share about 69%. In terms of application, PCs is the largest field with a share about 40 percent.

This report presents a comprehensive overview, market shares, and growth opportunities of FC BGA market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
4-8 Layers ABF Substrate
8-16 Layers ABF Substrate
Others

Segmentation by Application:
PCs
Server & Data Center
HPC/AI Chips
Communication
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
Shenzhen Fastprint Circuit Tech
Zhuhai Access Semiconductor
LG InnoTek
Shennan Circuit

Key Questions Addressed in this Report

What is the 10-year outlook for the global FC BGA market?

What factors are driving FC BGA market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do FC BGA market opportunities vary by end market size?

How does FC BGA break out by Type, by Application?



Please note: The report will take approximately 2 business days to prepare and deliver.