Global FC BGA Market Growth 2023-2029

Global FC BGA Market Growth 2023-2029

Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.

LPI (LP Information)' newest research report, the “FC BGA Industry Forecast” looks at past sales and reviews total world FC BGA sales in 2022, providing a comprehensive analysis by region and market sector of projected FC BGA sales for 2023 through 2029. With FC BGA sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world FC BGA industry.

This Insight Report provides a comprehensive analysis of the global FC BGA landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on FC BGA portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global FC BGA market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for FC BGA and breaks down the forecast by product, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global FC BGA.

The global FC BGA market size is projected to grow from US$ 4274 million in 2022 to US$ 6328.6 million in 2029; it is expected to grow at a CAGR of 6328.6 from 2023 to 2029.

Global key players of FC BGA (ABF (Ajinomoto Build-up Film) Substrate) include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, etc. The top five players hold a share over 68%. Asia-Pacific is the largest market, has a share about 77%, followed by North America and Europe, with share 13% and 7%, separately. In terms of product type, 4-8 Layers ABF Substrate is the largest segment, occupied for a share of 75%, and in terms of application, PCs has a share about 57 percent.

This report presents a comprehensive overview, market shares, and growth opportunities of FC BGA market by product product, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by product
4-8 Layers ABF Substrate
8-16 Layers ABF Substrate
Others

Segmentation by application
PCs
Server & Data Center
HPC/AI Chips
Communication
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
ACCESS
NCAP China
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech

Key Questions Addressed in this Report

What is the 10-year outlook for the global FC BGA market?

What factors are driving FC BGA market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do FC BGA market opportunities vary by end market size?

How does FC BGA break out product, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.