Global Embedded Chip Packaging Market Growth (Status and Outlook) 2025-2031

The global Embedded Chip Packaging market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

Embedding components into substrates using a multi-step manufacturing process.Single-chip, multi-chip, MEMS or passive components can be embedded in an organic laminate substrate in a side-by-side manner. These components are connected by copper-plated vias.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

LPI (LP Information)' newest research report, the “Embedded Chip Packaging Industry Forecast” looks at past sales and reviews total world Embedded Chip Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Embedded Chip Packaging sales for 2025 through 2031. With Embedded Chip Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Embedded Chip Packaging industry.

This Insight Report provides a comprehensive analysis of the global Embedded Chip Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Embedded Chip Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Embedded Chip Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Embedded Chip Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Embedded Chip Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Embedded Chip Packaging market by product type, application, key players and key regions and countries.

Segmentation by Type:
Single Chip
Multichip
MEMS
Passive Components

Segmentation by Application:
Tiny package
System-in-Boards
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE
ATS
GE
Shinko
Taiyo Yuden
TDK
Würth Elektronik
Texas Instruments
Siemens
Infineon
ST
Analog Devices
NXP
ATMEL
Samsung
MTK
Allwinner
Rockchip

Please note: The report will take approximately 2 business days to prepare and deliver.