Global Electrostatic Chucks for Wafer Market Growth 2023-2029

Global Electrostatic Chucks for Wafer Market Growth 2023-2029

The Electrostatic Chucks (ESC) is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.

LPI (LP Information)' newest research report, the “Electrostatic Chucks for Wafer Industry Forecast” looks at past sales and reviews total world Electrostatic Chucks for Wafer sales in 2022, providing a comprehensive analysis by region and market sector of projected Electrostatic Chucks for Wafer sales for 2023 through 2029. With Electrostatic Chucks for Wafer sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Electrostatic Chucks for Wafer industry.

This Insight Report provides a comprehensive analysis of the global Electrostatic Chucks for Wafer landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Electrostatic Chucks for Wafer portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Electrostatic Chucks for Wafer market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Electrostatic Chucks for Wafer and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electrostatic Chucks for Wafer.

The global Electrostatic Chucks for Wafer market size is projected to grow from US$ 218.8 million in 2022 to US$ 320.5 million in 2029; it is expected to grow at a CAGR of 320.5 from 2023 to 2029.

SHINKO dominated with 44.00% revenue market share, followed by TOTO with 17.00% revenue share and Creative Technology corporation with 9% revenue share.

This report presents a comprehensive overview, market shares, and growth opportunities of Electrostatic Chucks for Wafer market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
Coulomb Type Electrostatic Chucks
Johnsen-Rahbek (JR) Type Electrostatic Chucks

Segmentation by application
300 mm Wafer
200 mm Wafer
150 mm Wafer
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
SHINKO
TOTO
Creative Technology Corporation
Kyocera
FM Industries
NTK CERATEC
Tsukuba Seiko
Applied Materials
II-VI M Cubed

Key Questions Addressed in this Report

What is the 10-year outlook for the global Electrostatic Chucks for Wafer market?

What factors are driving Electrostatic Chucks for Wafer market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Electrostatic Chucks for Wafer market opportunities vary by end market size?

How does Electrostatic Chucks for Wafer break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.