Global Electrostatic Chuck Market Growth 2024-2030
An electrostatic chuck is a component inside semiconductor equipment that is used to hold the semiconductor wafer. In the IoT Society, the demand for semiconductor is growing, which in turn has led to annual increases in the need for installing semiconductor-manufacturing equipment. The Electrostatic Chuck for Semiconductor Process market covers Coulomb Type, Johnsen-Rahbek (JR) Type. The typical players include Applied Materials, Lam Research, SHINKO, TOTO, Sumitomo Osaka Cement, Creative Technology Corporation, Kyocera, Entegris, etc.
The global Electrostatic Chuck market size is projected to grow from US$ 1771 million in 2024 to US$ 2397 million in 2030; it is expected to grow at a CAGR of 5.2% from 2024 to 2030.
LP Information, Inc. (LPI) ' newest research report, the “Electrostatic Chuck Industry Forecast” looks at past sales and reviews total world Electrostatic Chuck sales in 2023, providing a comprehensive analysis by region and market sector of projected Electrostatic Chuck sales for 2024 through 2030. With Electrostatic Chuck sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Electrostatic Chuck industry.
This Insight Report provides a comprehensive analysis of the global Electrostatic Chuck landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Electrostatic Chuck portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Electrostatic Chuck market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Electrostatic Chuck and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electrostatic Chuck.
Global key players of Electrostatic Chuck include Applied Materials, Lam Research, SHINKO, TOTO, Sumitomo Osaka Cement, etc. The top five players hold a share about 93%. Asia Pacific is the largest market, and has a share about 75%, followed by North America and Europe with share 19% and 5%, separately. In terms of product type, Coulomb Type is the largest segment, occupied for a share of 69%. In terms of application, 300 mm Wafer is the largest field with a share about 78 percent.
This report presents a comprehensive overview, market shares, and growth opportunities of Electrostatic Chuck market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Coulomb Type
Johnsen-Rahbek (JR) Type
Segmentation by Application:
300 mm Wafer
200 mm Wafer
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Applied Materials
Lam Research
SHINKO
TOTO
Sumitomo Osaka Cement
Creative Technology Corporation
Kyocera
Entegris
NTK CERATEC
II-VI M Cubed
Tsukuba Seiko
Calitech
Beijing U-PRECISION TECH
NGK Insulators
Key Questions Addressed in this Report
What is the 10-year outlook for the global Electrostatic Chuck market?
What factors are driving Electrostatic Chuck market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Electrostatic Chuck market opportunities vary by end market size?
How does Electrostatic Chuck break out by Type, by Application?
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