Global Electronic Packaging Materials Market Growth 2023-2029

Global Electronic Packaging Materials Market Growth 2023-2029

This report studies the Electronic Packaging Materials market.

Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.

Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
LPI (LP Information)' newest research report, the “Electronic Packaging Materials Industry Forecast” looks at past sales and reviews total world Electronic Packaging Materials sales in 2022, providing a comprehensive analysis by region and market sector of projected Electronic Packaging Materials sales for 2023 through 2029. With Electronic Packaging Materials sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Electronic Packaging Materials industry.
This Insight Report provides a comprehensive analysis of the global Electronic Packaging Materials landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Electronic Packaging Materials portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Electronic Packaging Materials market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Electronic Packaging Materials and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electronic Packaging Materials.
The global Electronic Packaging Materials market size is projected to grow from US$ 5365.4 million in 2022 to US$ 6556.1 million in 2029; it is expected to grow at a CAGR of 6556.1 from 2023 to 2029.
The leading manufacturers of electronic packaging materials include Sumitomo Chemical, Shinko Electric Industries, Toppan, Tanaka, Mitsui High-Tec and others, with the top three accounting for about 25% of the market.
China is the main market, accounting for about 40%, followed by the United States, accounting for about 15%.
This report presents a comprehensive overview, market shares, and growth opportunities of Electronic Packaging Materials market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
Metal Packages
Plastic Packages
Ceramic Packages
Segmentation by application
Semiconductor & IC
PCB
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang
Key Questions Addressed in this Report
What is the 10-year outlook for the global Electronic Packaging Materials market?
What factors are driving Electronic Packaging Materials market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Electronic Packaging Materials market opportunities vary by end market size?
How does Electronic Packaging Materials break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.