Global Electronic Assembly Adhesives Market Growth 2025-2031

The global Electronic Assembly Adhesives market size is predicted to grow from US$ 8669 million in 2025 to US$ 13750 million in 2031; it is expected to grow at a CAGR of 8.0% from 2025 to 2031.

Electronic assembly adhesives are used to bond electronic components together. They are typically made of a thermosetting resin that cures when exposed to heat or moisture.

In recent years, electronic assemblies have become increasingly reliant upon advanced adhesives capable of meeting specific performance criteria to ensure reliable device operation and longevity within unforgiving environments. These adhesives must offer precise bond strengths able to resist thermal expansion mismatches between dissimilar materials subjected to wide temperature fluctuations encountered throughout their useful lifespans. Moreover, electronic devices commonly require customized adhesives tailored for precise applications within harsh environments such as high humidity levels or aggressively corrosive atmospheres found across industrial settings like oil rigs or coastal areas where salt spray damage can occur quickly.

LP Information, Inc. (LPI) ' newest research report, the “Electronic Assembly Adhesives Industry Forecast” looks at past sales and reviews total world Electronic Assembly Adhesives sales in 2024, providing a comprehensive analysis by region and market sector of projected Electronic Assembly Adhesives sales for 2025 through 2031. With Electronic Assembly Adhesives sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Electronic Assembly Adhesives industry.

This Insight Report provides a comprehensive analysis of the global Electronic Assembly Adhesives landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Electronic Assembly Adhesives portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Electronic Assembly Adhesives market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Electronic Assembly Adhesives and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electronic Assembly Adhesives.

This report presents a comprehensive overview, market shares, and growth opportunities of Electronic Assembly Adhesives market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Electrically Conductive Adhesives
Non-Electrically Conductive Adhesives

Segmentation by Application:
Consumer Electronics Products
Industrial Electronics
Automotive
Military and Serospace
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DOW
H.B. Fuller
Henkel
DuPont
3M
Sekisui Chemical
Alpha
Permabond
Evonik
Masterbond
Bostik
Hexion
ITW Performance Polymers
Jowat
LORD Corp
DELO Industrial Adhesives
Huntsman
Hexion
Mitsubishi Chemical
Shinetsu
Lintec Corporation

Key Questions Addressed in this Report

What is the 10-year outlook for the global Electronic Assembly Adhesives market?

What factors are driving Electronic Assembly Adhesives market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Electronic Assembly Adhesives market opportunities vary by end market size?

How does Electronic Assembly Adhesives break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.