Global Electroless Plating Solutions for Package Substrate Market Growth (Status and Outlook) 2024-2030

Global Electroless Plating Solutions for Package Substrate Market Growth (Status and Outlook) 2024-2030

The global Electroless Plating Solutions for Package Substrate market size is projected to grow from US$ 194 million in 2024 to US$ 309 million in 2030; it is expected to grow at a CAGR of 8.1% from 2024 to 2030.

LPI (LP Information)' newest research report, the “Electroless Plating Solutions for Package Substrate Industry Forecast” looks at past sales and reviews total world Electroless Plating Solutions for Package Substrate sales in 2022, providing a comprehensive analysis by region and market sector of projected Electroless Plating Solutions for Package Substrate sales for 2023 through 2029. With Electroless Plating Solutions for Package Substrate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Electroless Plating Solutions for Package Substrate industry.

This Insight Report provides a comprehensive analysis of the global Electroless Plating Solutions for Package Substrate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Electroless Plating Solutions for Package Substrate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Electroless Plating Solutions for Package Substrate market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Electroless Plating Solutions for Package Substrate and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electroless Plating Solutions for Package Substrate.

Chemical plating solutions for packaging substrates mainly include electroless nickel plating solutions, chemical palladium plating solutions, chemical gold plating solutions, chemical copper plating solutions, chemical tin plating solutions, degreasing, activation, etc. Among them, the ENEPIG solution can form a nickel-palladium-gold three-layer structure on the lead frame and the pad of the packaging substrate to improve the welding reliability under lead-free solder and prevent failure caused by sulfides.

In the field of IC packaging substrates, the chemical plating solution market is mainly monopolized by the top 1/2 companies. The main reason is that in the field of chemical surface treatment solutions, they are basically designated suppliers. Globally, the TOP5 companies are Uemura, Atotech, Dow Electronic Materials (DuPont), Tanaka, and YMT, with a market share of over 82%.

This report presents a comprehensive overview, market shares, and growth opportunities of Electroless Plating Solutions for Package Substrate market by product type, application, key players and key regions and countries.

Segmentation by Type:
ENEPIG
ENIG
Others

Segmentation by Application:
FC Package Substrate
WB Package Substrate

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

Segmentation by Type:
ENEPIG
ENIG
Others

Segmentation by Application:
FC Package Substrate
WB Package Substrate

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
C. Uyemura & Co
Atotech (MKS)
DOW Electronic Materials (Dupont)
TANAKA
YMT
MK Chem & Tech Co., Ltd
Shenzhen Yicheng Electronic
KPM Tech Vina
OKUNO Chemical Industries

Please note: The report will take approximately 2 business days to prepare and deliver.