Global Electrodeposited Copper Foil for Printed Circuit Boards Market Growth 2024-2030

Global Electrodeposited Copper Foil for Printed Circuit Boards Market Growth 2024-2030

The global Electrodeposited Copper Foil for Printed Circuit Boards market size is projected to grow from US$ 326.7 million in 2023 to US$ 459.1 million in 2030; it is expected to grow at a CAGR of 5.0% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Electrodeposited Copper Foil for Printed Circuit Boards Industry Forecast” looks at past sales and reviews total world Electrodeposited Copper Foil for Printed Circuit Boards sales in 2023, providing a comprehensive analysis by region and market sector of projected Electrodeposited Copper Foil for Printed Circuit Boards sales for 2024 through 2030. With Electrodeposited Copper Foil for Printed Circuit Boards sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Electrodeposited Copper Foil for Printed Circuit Boards industry.

This Insight Report provides a comprehensive analysis of the global Electrodeposited Copper Foil for Printed Circuit Boards landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Electrodeposited Copper Foil for Printed Circuit Boards portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Electrodeposited Copper Foil for Printed Circuit Boards market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Electrodeposited Copper Foil for Printed Circuit Boards and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electrodeposited Copper Foil for Printed Circuit Boards.

According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.

This report presents a comprehensive overview, market shares, and growth opportunities of Electrodeposited Copper Foil for Printed Circuit Boards market by product type, application, key manufacturers and key regions and countries.

Segmentation by type
Below 20 μm
20-50 μm
Above 50 μm

Segmentation by application
Single Sided Board
Double Sided Board
Multi Layered Board

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Mitsui Mining & Smelting
JX Nippon Mining & Metals
Jiangxi Copper
Furukawa Electric
Nan Ya Plastics
Arcotech
Kingboard Copper Foil
Guangdong Chaohua Technology
Ls Mtron
Chang Chun Petrochemical
Minerex
Circuit Foil Luxembourg
Suzhou Fukuda Metal
LingBao Wason Copper Foil
Targray Technology International
Shandong Jinbao Electronics

Key Questions Addressed in this Report

What is the 10-year outlook for the global Electrodeposited Copper Foil for Printed Circuit Boards market?

What factors are driving Electrodeposited Copper Foil for Printed Circuit Boards market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Electrodeposited Copper Foil for Printed Circuit Boards market opportunities vary by end market size?

How does Electrodeposited Copper Foil for Printed Circuit Boards break out type, application?

Please note: The report will take approximately 2 business days to prepare and deliver.