Global Die Sorting Equipment Market Growth 2025-2031
The global Die Sorting Equipment market size is predicted to grow from US$ 347 million in 2025 to US$ 490 million in 2031; it is expected to grow at a CAGR of 5.9% from 2025 to 2031.
Die sorting equipment, often referred to as die sorters, are machines used in semiconductor manufacturing to sort and categorize individual dies based on various criteria such as performance, electrical characteristics, or defects. These machines play a crucial role in the production of integrated circuits (ICs) and other electronic devices by ensuring that only dies meeting specific quality standards are used in the assembly process.
The Global key players of Die Sorting Equipment include KLA-Tencor, YAC Garter, Ueno Seiki, etc. The top three players hold a share about 37%. APAC is the largest market, and has a share about 83%. In terms of product type, High Speed Die Sorting is the largest segment, which occupied for a share of about 83%. For application, OSATs is the largest segment, which has a share about 76%.
LP Information, Inc. (LPI) ' newest research report, the “Die Sorting Equipment Industry Forecast” looks at past sales and reviews total world Die Sorting Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Die Sorting Equipment sales for 2025 through 2031. With Die Sorting Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Die Sorting Equipment industry.
This Insight Report provides a comprehensive analysis of the global Die Sorting Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Die Sorting Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Die Sorting Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Die Sorting Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Die Sorting Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Die Sorting Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
High Speed Die Sorting
Standard Speed Die Sorting
Segmentation by Application:
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
KLA-Tencor
YAC Garter
Ueno Seiki
MPI Corporation
Semiconductor Technologies & Instruments Pte Ltd
Air-Vac Automation
Suzhou MTS Automation Equipment
Mühlbauer
Canon Machinery
Cohu
Key Questions Addressed in this Report
What is the 10-year outlook for the global Die Sorting Equipment market?
What factors are driving Die Sorting Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Die Sorting Equipment market opportunities vary by end market size?
How does Die Sorting Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.