Global Die Bonder Equipment Market Growth 2023-2029

Global Die Bonder Equipment Market Growth 2023-2029

Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass

LPI (LP Information)' newest research report, the “Die Bonder Equipment Industry Forecast” looks at past sales and reviews total world Die Bonder Equipment sales in 2022, providing a comprehensive analysis by region and market sector of projected Die Bonder Equipment sales for 2023 through 2029. With Die Bonder Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Die Bonder Equipment industry.

This Insight Report provides a comprehensive analysis of the global Die Bonder Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Die Bonder Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Die Bonder Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Die Bonder Equipment and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Die Bonder Equipment.

The global Die Bonder Equipment market size is projected to grow from US$ 773.7 million in 2022 to US$ 925.6 million in 2029; it is expected to grow at a CAGR of 925.6 from 2023 to 2029.

Die Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32% of the total output of global Die Bonder Equipment. Besi, ASM Pacific Technology(ASMPT), Kulicke & Soffa, Palomar Technologies, Shinkawa and DIAS Automation are the key manufacturers of Die Bonder Equipment. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39%, in terms of revenue.

This report presents a comprehensive overview, market shares, and growth opportunities of Die Bonder Equipment market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
Fully Automatic Die Bonder
Semi-Automatic Die Bonder
Manual Die Bonder

Segmentation by application
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Besi
ASM Pacific Technology(ASMPT)
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond

Key Questions Addressed in this Report

What is the 10-year outlook for the global Die Bonder Equipment market?

What factors are driving Die Bonder Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Die Bonder Equipment market opportunities vary by end market size?

How does Die Bonder Equipment break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.