Global Die Attach Paste Market Growth 2025-2031

Global Die Attach Paste Market Growth 2025-2031

The global Die Attach Paste market size is predicted to grow from US$ 740 million in 2025 to US$ 945 million in 2031; it is expected to grow at a CAGR of 4.1% from 2025 to 2031.

Die-attach are the term reserved for processes where the face of a die is attached to a substrate by a single joint.Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content.

Overall economic performance will continue to be the best indicator of future demand for Die Attach Paste. Asia Pacific alone is projected to account for a large percentage of new Die Attach Paste demand anticipated through 2026; the region’s growing middle class, improving living standards, and fast-developing infrastructure is driving significant industry growth. The competition among vendors will increase during the forecast period.

LP Information, Inc. (LPI) ' newest research report, the “Die Attach Paste Industry Forecast” looks at past sales and reviews total world Die Attach Paste sales in 2024, providing a comprehensive analysis by region and market sector of projected Die Attach Paste sales for 2025 through 2031. With Die Attach Paste sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Die Attach Paste industry.

This Insight Report provides a comprehensive analysis of the global Die Attach Paste landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Die Attach Paste portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Die Attach Paste market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Die Attach Paste and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Die Attach Paste.

This report presents a comprehensive overview, market shares, and growth opportunities of Die Attach Paste market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
No-Clean Pastes
Rosin Based Pastes
Water Soluble Pastes
Others

Segmentation by Application:
SMT Assembly
Semiconductor Packaging
Automotive
Medical
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
SMIC
Alpha Assembly Solutions
Shenmao Technology
Henkel
Shenzhen Weite New Material
Indium
Tongfang Tech
Heraeu
Sumitomo Bakelite
AIM
Tamura
Asahi Solder
Kyocera
Shanghai Jinji
NAMICS
Hitachi Chemical
Nordson EFD
Dow
Inkron
Palomar Technologies

Key Questions Addressed in this Report

What is the 10-year outlook for the global Die Attach Paste market?

What factors are driving Die Attach Paste market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Die Attach Paste market opportunities vary by end market size?

How does Die Attach Paste break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.