Global Die Attach Compound Market Growth 2024-2030

Global Die Attach Compound Market Growth 2024-2030

Die attach compounds are materials used in the assembly of semiconductor devices to attach a die to a substrate, such as a leadframe or a printed circuit board. These compounds are used to bond the die to the substrate, and typically contain a filler material such as silver, copper, or aluminum, mixed with a resin or adhesive. The compound must have a high thermal conductivity to help dissipate heat generated by the device, and must also provide good adhesion and electrical conductivity. Die attach compounds are often applied to the substrate by dispensing, stenciling, or screen printing, and are then cured by heat or ultraviolet light.

The global Die Attach Compound market size is projected to grow from US$ 1633 million in 2024 to US$ 2658 million in 2030; it is expected to grow at a CAGR of 8.5% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Die Attach Compound Industry Forecast” looks at past sales and reviews total world Die Attach Compound sales in 2023, providing a comprehensive analysis by region and market sector of projected Die Attach Compound sales for 2024 through 2030. With Die Attach Compound sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Die Attach Compound industry.

This Insight Report provides a comprehensive analysis of the global Die Attach Compound landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Die Attach Compound portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Die Attach Compound market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Die Attach Compound and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Die Attach Compound.

United States market for Die Attach Compound is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for Die Attach Compound is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for Die Attach Compound is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key Die Attach Compound players cover Ajinomoto, Protavic, Sanyu Rec, YINCAE Advanced Materials, Nagase Group, etc. In terms of revenue, the global two largest companies occupied for a share nearly

% in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of Die Attach Compound market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Electrically Conductive
Dielectric

Segmentation by Application:
Consumer Electronics
Automotive
Aerospace
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Ajinomoto
Protavic
Sanyu Rec
YINCAE Advanced Materials
Nagase Group
KCC Corporation
Parker
NAMICS Corporation
Panacol-Elosol GmbH
DELO Adhesives
Henkel
Alpha Advanced Materials
Bonotec Electronic Materials
YizTech
Yongoo Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Die Attach Compound market?

What factors are driving Die Attach Compound market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Die Attach Compound market opportunities vary by end market size?

How does Die Attach Compound break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.