Global Dicing Die Attach Film Market Growth 2024-2030

Global Dicing Die Attach Film Market Growth 2024-2030

Die Attach Film is adhesive film which is used for semiconductor process. It is combined with dicing tape, and it is called as Dicing Die Attach Film.

The global Dicing Die Attach Film market size is projected to grow from US$ 294 million in 2024 to US$ 449 million in 2030; it is expected to grow at a CAGR of 7.3% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Dicing Die Attach Film Industry Forecast” looks at past sales and reviews total world Dicing Die Attach Film sales in 2023, providing a comprehensive analysis by region and market sector of projected Dicing Die Attach Film sales for 2024 through 2030. With Dicing Die Attach Film sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Dicing Die Attach Film industry.

This Insight Report provides a comprehensive analysis of the global Dicing Die Attach Film landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Dicing Die Attach Film portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Dicing Die Attach Film market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Dicing Die Attach Film and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Dicing Die Attach Film.

The core manufacturers of global Dicing Die Attach Film include Hitachi Chemical, Henkel Adhesives and Nitto. The top three manufacturers account for about 77% of the global share. China Taiwan is the world's largest dicing die attach film market, accounting for about 45%, followed by China and North America, accounting for 19% and 14% respectively.

In terms of product type, non-conductive type is the largest segment, accounting for approximately 92%. At the same time, in terms of application, die to die is the largest application area, accounting for approximately 51%.

This report presents a comprehensive overview, market shares, and growth opportunities of Dicing Die Attach Film market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Non-Conductive Type
Conductive Type

Segmentation by Application:
Die to Substrate
Die to Die
Film on Wire

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Hitachi Chemical
Henkel Adhesives
Nitto
LINTEC Corporation
Furukawa
LG
AI Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Dicing Die Attach Film market?

What factors are driving Dicing Die Attach Film market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Dicing Die Attach Film market opportunities vary by end market size?

How does Dicing Die Attach Film break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.