Global Contactless IC Card Chip Market Growth 2025-2031
The global Contactless IC Card Chip market size is predicted to grow from US$ 4291 million in 2025 to US$ 6864 million in 2031; it is expected to grow at a CAGR of 8.1% from 2025 to 2031.
A contactless IC card chip is an integrated circuit (IC) chip that communicates with a card reader device through wireless radio frequency technology without physical contact. Its core technologies include RFID (radio frequency identification) and NFC (near field communication), which are widely used in various scenarios such as electronic payment, identity authentication, access control systems, and public transportation. These chips have built-in antennas and microprocessors, which can transmit and process data through wireless signals within a certain range. Due to their high security, convenience and durability, contactless IC card chips have been widely used and recognized worldwide.
From the perspective of market regional distribution, Asia Pacific and North America rank first and second in terms of contactless IC card chip shipments, respectively. In 2023, the two regions' combined contactless IC card shipments account for 70% of the world's total. In the past three years, the sales share of the Asia Pacific region has steadily increased, mainly due to the year-on-year growth in the business scale of emerging markets represented by China, India, and Indonesia. It is expected that the Asia Pacific region will become the main growth engine of the global contactless IC card chip market in the future. Populous developing countries such as China, India, and Indonesia are crucial to the overall healthy development of the contactless IC card chip market.
The application modes of contactless IC card chip companies are mainly divided into IDM mode and Fabless mode. The IDM mode integrates IC design, manufacturing, packaging and testing, and even downstream electronic terminal product production. Most integrated circuit companies adopted this mode in the early days. Currently, only a very small number of companies can maintain it. For example, NXP Semiconductors, Infineon and Unigroup. The Fabless model is only responsible for the circuit design and sales of chips, and outsources production, testing, packaging and other links, such as Shanghai Fudan Microelectronics Group.
The main players in contactless IC card chips include NXP Semiconductors, Infineon, Texas Instruments, STMicroelectronics, Samsung, Unigroup Guoxin Microelectronics Co., Ltd., Shanghai Fudan Microelectronics Group Co., Ltd., etc. The top three global manufacturers accounted for 44% in 2023.
In the context of the information age, the transformation and upgrading of traditional industries has generated a large number of application demands for integrated circuit products, including financial security, security monitoring, the Internet of Things, etc. The vast downstream application fields have steadily supported the continued development of the contactless IC card chip industry.
LP Information, Inc. (LPI) ' newest research report, the “Contactless IC Card Chip Industry Forecast” looks at past sales and reviews total world Contactless IC Card Chip sales in 2024, providing a comprehensive analysis by region and market sector of projected Contactless IC Card Chip sales for 2025 through 2031. With Contactless IC Card Chip sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Contactless IC Card Chip industry.
This Insight Report provides a comprehensive analysis of the global Contactless IC Card Chip landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Contactless IC Card Chip portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Contactless IC Card Chip market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Contactless IC Card Chip and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Contactless IC Card Chip.
This report presents a comprehensive overview, market shares, and growth opportunities of Contactless IC Card Chip market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
ISO/IEC 14443 A
ISO/IEC 14443 B
Others
Segmentation by Application:
BFSI
Government & Public Utilities
Transportation
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
NXP Semiconductors
Infineon
Texas Instruments
STMicroelectronics
Samsung
Unigroup Guoxin Microelectronics Co., Ltd.
Shanghai Fudan Microelectronics Group Co., Ltd.
HED
Datang Telecom Technology Co.,Ltd.
Nations Technologies Inc.
Giantec Semiconductor Corporation.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Contactless IC Card Chip market?
What factors are driving Contactless IC Card Chip market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Contactless IC Card Chip market opportunities vary by end market size?
How does Contactless IC Card Chip break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.