Global Cobalt CMP Slurries Market Growth 2025-2031

The global Cobalt CMP Slurries market size is predicted to grow from US$ 26.8 million in 2025 to US$ 88.9 million in 2031; it is expected to grow at a CAGR of 22.1% from 2025 to 2031.

Cobalt polishing liquids are widely used in technology nodes of 10nm and below, and cobalt will partially replace copper as wires. Cobalt CMP slurries are designed to polish cobalt and barrier metals and planarize all films in the circuits during advanced Cobalt interconnect polish.

TSMC, Samsung and Intel are the three foundry companies in the world that have achieved 3nm, 5nm and 7nm processes. According to TSMC's annual report, TSMC's 7nm, 5nm, and 3nm revenues accounted for 58% of its total foundry revenue in 2023, and are expected to increase further in the next few years. Samsung's cutting-edge process revenue, in 2023, the company's 3nm, 5m and 7nm revenue accounted for more than 55% of its total foundry revenue, and it is expected to exceed 60% in 2024. Intel's cutting-edge foundry business is relatively weaker than TSMC and Samsung, and it has not yet mass-produced 3nm process. In 2023, Intel's 5nm and 7nm process revenue accounted for approximately 27% of total foundry revenue.

LP Information, Inc. (LPI) ' newest research report, the “Cobalt CMP Slurries Industry Forecast” looks at past sales and reviews total world Cobalt CMP Slurries sales in 2024, providing a comprehensive analysis by region and market sector of projected Cobalt CMP Slurries sales for 2025 through 2031. With Cobalt CMP Slurries sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Cobalt CMP Slurries industry.

This Insight Report provides a comprehensive analysis of the global Cobalt CMP Slurries landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Cobalt CMP Slurries portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Cobalt CMP Slurries market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Cobalt CMP Slurries and breaks down the forecast by Process Node, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Cobalt CMP Slurries.

This report presents a comprehensive overview, market shares, and growth opportunities of Cobalt CMP Slurries market by product type, application, key manufacturers and key regions and countries.

Segmentation by Process Node:
7 and 5nm Node
3 and 2nm Node

Segmentation by Application:
Smart Phone
High-Performance Computing (HPC)
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Fujifilm
DuPont
Fujimi Corporation

Key Questions Addressed in this Report

What is the 10-year outlook for the global Cobalt CMP Slurries market?

What factors are driving Cobalt CMP Slurries market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Cobalt CMP Slurries market opportunities vary by end market size?

How does Cobalt CMP Slurries break out by Process Node, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.