Global Circuit Board Heat Sink Market Growth 2024-2030

Global Circuit Board Heat Sink Market Growth 2024-2030

A circuit board heat sink is a cooling device attached to the circuit boards of electronic equipment and computers. They are used to stabilize circuit operation by dissipating heat generated by electronic and electrical components mounted on printed circuit boards. Semiconductor components in various circuits tend to generate large amounts of heat when large drive power is required.

With the evolution of semiconductor processes, large-scale integrated circuits have been realized in extremely small sizes. In devices that realize such complex and advanced functions and performance, the amount of heat generated is also often large. To reduce the amount of heat generated, various efforts are being made on the semiconductor device side to reduce power consumption. However, in most cases, heat sinks are required to maintain stable operation when used in various environments.

The global Circuit Board Heat Sink market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Circuit Board Heat Sink Industry Forecast” looks at past sales and reviews total world Circuit Board Heat Sink sales in 2023, providing a comprehensive analysis by region and market sector of projected Circuit Board Heat Sink sales for 2024 through 2030. With Circuit Board Heat Sink sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Circuit Board Heat Sink industry.

This Insight Report provides a comprehensive analysis of the global Circuit Board Heat Sink landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Circuit Board Heat Sink portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Circuit Board Heat Sink market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Circuit Board Heat Sink and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Circuit Board Heat Sink.

United States market for Circuit Board Heat Sink is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for Circuit Board Heat Sink is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for Circuit Board Heat Sink is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key Circuit Board Heat Sink players cover Nishimura Advanced Ceramics, Millennium Circuits Limited, Epec, A.L.M.T. Corp., Nippon Electric Glass, etc. In terms of revenue, the global two largest companies occupied for a share nearly

% in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of Circuit Board Heat Sink market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Natural Air Cooling
Forced Air Cooling

Segmentation by Application:
Industrial Equipment
Consumer Electronics
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Nishimura Advanced Ceramics
Millennium Circuits Limited
Epec
A.L.M.T. Corp.
Nippon Electric Glass
Resonac Holdings Corporation
RayMing Technology
Himalay Engineering
PW Circuits Ltd
Zaward Corporation
db Electronic
TAKAGI MFG.CO.,LTD.

Key Questions Addressed in this Report

What is the 10-year outlook for the global Circuit Board Heat Sink market?

What factors are driving Circuit Board Heat Sink market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Circuit Board Heat Sink market opportunities vary by end market size?

How does Circuit Board Heat Sink break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.