Global Chip Packaging Market Growth (Status and Outlook) 2025-2031

Global Chip Packaging Market Growth (Status and Outlook) 2025-2031

The global Chip Packaging market size is predicted to grow from US$ 34530 million in 2025 to US$ 51080 million in 2031; it is expected to grow at a CAGR of 6.7% from 2025 to 2031.

Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on

The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.

By type breakdown, all markets for chip packages can be divided into the following categories:

The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.

The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.

From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.

The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.

LPI (LP Information)' newest research report, the “Chip Packaging Industry Forecast” looks at past sales and reviews total world Chip Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Chip Packaging sales for 2025 through 2031. With Chip Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chip Packaging industry.

This Insight Report provides a comprehensive analysis of the global Chip Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Chip Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Chip Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chip Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chip Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Chip Packaging market by product type, application, key players and key regions and countries.

Segmentation by Type:
Traditional Packaging
Advanced Packaging

Segmentation by Application:
Automotive and Traffic
Consumer Electronics
Communication
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS

Please note: The report will take approximately 2 business days to prepare and deliver.