Global Chip On Flex (COF) Market Growth 2025-2031

The global Chip On Flex (COF) market size is predicted to grow from US$ 1913 million in 2025 to US$ 2515 million in 2031; it is expected to grow at a CAGR of 4.7% from 2025 to 2031.

Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn"t have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.

This industry is centralized. Top 3 companies in the market occupies about 51% of the Revenue market shares. The major manufacturers of Chip on Flex (COF) are LGIT, Stemco, Flexceed, Chipbond Technology, CWE, Danbond Technology, AKM Industrial, Compass Technology Company, Compunetics and STARS Microelectronics.

LP Information, Inc. (LPI) ' newest research report, the “Chip On Flex (COF) Industry Forecast” looks at past sales and reviews total world Chip On Flex (COF) sales in 2024, providing a comprehensive analysis by region and market sector of projected Chip On Flex (COF) sales for 2025 through 2031. With Chip On Flex (COF) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chip On Flex (COF) industry.

This Insight Report provides a comprehensive analysis of the global Chip On Flex (COF) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Chip On Flex (COF) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Chip On Flex (COF) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chip On Flex (COF) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chip On Flex (COF).

This report presents a comprehensive overview, market shares, and growth opportunities of Chip On Flex (COF) market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Single Sided COF
Others

Segmentation by Application:
Military
Medical
Aerospace
Electronics
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
LGIT
Stemco
Flexceed
Chipbond Technology
CWE
Danbond Technology
AKM Industrial
Compass Technology Company
Compunetics
STARS Microelectronics

Key Questions Addressed in this Report

What is the 10-year outlook for the global Chip On Flex (COF) market?

What factors are driving Chip On Flex (COF) market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Chip On Flex (COF) market opportunities vary by end market size?

How does Chip On Flex (COF) break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.