Global Chip On Film Underfill (COF) Market Growth 2023-2029

Global Chip On Film Underfill (COF) Market Growth 2023-2029

Underfills serve the purpose of equalizing stresses between chip and substrate. Chips are attached directly to the interconnection points without intermediate elements. Stresses arise at the solder bumps when the electronic modules are heated and cooled during operation due to the different coefficients of thermal expansion of the substrates. Underfill technology was developed to counteract these mechanical influences. The Chip On Film Underfill (COF) market covers Capillary Underfill (CUF), No Flow Underfill (NUF), Non-Conductive Paste (NCP) Underfill, Non-Conductive Film (NCF) Underfill, Molded Underfill (MUF) Underfill, etc. The typical players include Namics Corporation, AI Technology, Henkel, Shenzhen Dover, Darbond, LORD Corporation, Panacol, Won Chemical, etc.
LPI (LP Information)' newest research report, the “Chip On Film Underfill (COF) Industry Forecast” looks at past sales and reviews total world Chip On Film Underfill (COF) sales in 2022, providing a comprehensive analysis by region and market sector of projected Chip On Film Underfill (COF) sales for 2023 through 2029. With Chip On Film Underfill (COF) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chip On Film Underfill (COF) industry.
This Insight Report provides a comprehensive analysis of the global Chip On Film Underfill (COF) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Chip On Film Underfill (COF) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Chip On Film Underfill (COF) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chip On Film Underfill (COF) and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chip On Film Underfill (COF).
The global Chip On Film Underfill (COF) market size is projected to grow from US$ 353.1 million in 2022 to US$ 446.9 million in 2029; it is expected to grow at a CAGR of 446.9 from 2023 to 2029.
Global Chip On Film Underfill (COF) includes Henkel, Won Chemical, etc. Global top 2 companies hold a share over 43.19%. Asia-Pacific is the largest market, with a share about 49.18%, followed by North America and Europe with the share about 24.91% and 18.09%.
This report presents a comprehensive overview, market shares, and growth opportunities of Chip On Film Underfill (COF) market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
Capillary Underfill (CUF)
No Flow Underfill (NUF)
Non-Conductive Paste (NCP) Underfill
Non-Conductive Film (NCF) Underfill
Molded Underfill (MUF) Underfill
Segmentation by application
Cell Phone
Tablet
LCD Display
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Henkel
Won Chemical
LORD Corporation
Hanstars
Fuji Chemical
Panacol
Namics Corporation
Shenzhen Dover
Shin-Etsu Chemical
Bondline
Zymet
AIM Solder
MacDermid (Alpha Advanced Materials)
Darbond
AI Technology
Master Bond

Key Questions Addressed in this Report
What is the 10-year outlook for the global Chip On Film Underfill (COF) market?
What factors are driving Chip On Film Underfill (COF) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Chip On Film Underfill (COF) market opportunities vary by end market size?
How does Chip On Film Underfill (COF) break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.