Global Chemical Mechanical Planarization Market Growth (Status and Outlook) 2023-2029

Global Chemical Mechanical Planarization Market Growth (Status and Outlook) 2023-2029

Chemical Mechanical Planarization (CMP) is a polishing process, which utilizes a chemical slurry formulation and mechanical polishing process to remove unwanted conductive or dielectric materials on the silicon wafer, achieving a near-perfect flat and smooth surface upon which layers of integrated circuitry are built. The report covers the CMP equipment and CMP consumable (slurry, pad, pad conditioner and others).
LPI (LP Information)' newest research report, the “Chemical Mechanical Planarization Industry Forecast” looks at past sales and reviews total world Chemical Mechanical Planarization sales in 2022, providing a comprehensive analysis by region and market sector of projected Chemical Mechanical Planarization sales for 2023 through 2029. With Chemical Mechanical Planarization sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chemical Mechanical Planarization industry.
This Insight Report provides a comprehensive analysis of the global Chemical Mechanical Planarization landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Chemical Mechanical Planarization portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Chemical Mechanical Planarization market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chemical Mechanical Planarization and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chemical Mechanical Planarization.
The global Chemical Mechanical Planarization market size is projected to grow from US$ 4944.6 million in 2022 to US$ 7807.3 million in 2029; it is expected to grow at a CAGR of 6.7% from 2023 to 2029.
United States market for Chemical Mechanical Planarization is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
China market for Chemical Mechanical Planarization is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Europe market for Chemical Mechanical Planarization is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Global key Chemical Mechanical Planarization players cover DuPont, Ebara, Cabot Microelectronics, Applied Materials, Hitachi Chemical, Merck KGaA (Versum Materials), Fujifilm, Fujimi and 3M, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.
This report presents a comprehensive overview, market shares, and growth opportunities of Chemical Mechanical Planarization market by product type, application, key players and key regions and countries.
Market Segmentation:
Segmentation by type
CMP Equipment
CMP Slurries
CMP Pad
CMP Pad Conditioners
Others
Segmentation by application
IC Manufacturing
MEMS & NEM
Optics
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
DuPont
Ebara
Cabot Microelectronics
Applied Materials
Hitachi Chemical
Merck KGaA (Versum Materials)
Fujifilm
Fujimi
3M
Entegris
FUJIBO
Anji Microelectronics
Saesol
AGC

Please note: The report will take approximately 2 business days to prepare and deliver.