Global Ball Grid Array (BGA) PCB Market Growth 2023-2029

Global Ball Grid Array (BGA) PCB Market Growth 2023-2029

The PCB used for placing the BGA components is known as BGA PCB. It contains similar connections, just like the ball grid array present on the back of the BGA package. The component is placed over the PCB and then soldered. After soldering, the package looks as if it is pasted on the board with glue. There are no leads or connections on the side of the BGA package, and it makes the PCB more reliable and offers many benefits.

LPI (LP Information)' newest research report, the “Ball Grid Array (BGA) PCB Industry Forecast” looks at past sales and reviews total world Ball Grid Array (BGA) PCB sales in 2022, providing a comprehensive analysis by region and market sector of projected Ball Grid Array (BGA) PCB sales for 2023 through 2029. With Ball Grid Array (BGA) PCB sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Ball Grid Array (BGA) PCB industry.

This Insight Report provides a comprehensive analysis of the global Ball Grid Array (BGA) PCB landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Ball Grid Array (BGA) PCB portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Ball Grid Array (BGA) PCB market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Ball Grid Array (BGA) PCB and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Ball Grid Array (BGA) PCB.

The global Ball Grid Array (BGA) PCB market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.

United States market for Ball Grid Array (BGA) PCB is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

China market for Ball Grid Array (BGA) PCB is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Europe market for Ball Grid Array (BGA) PCB is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Global key Ball Grid Array (BGA) PCB players cover Samsung Electro-Mechanics, Nanya PCB, TTM Technologies Inc., Unimicron, Shennan Circuits, CMK Corporation, Kingboard, Creative Hi-tech Ltd. and Mer-Mar Electronics, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.

This report presents a comprehensive overview, market shares, and growth opportunities of Ball Grid Array (BGA) PCB market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
Plastic Ball Grid Array
Ceramic Ball Grid Array
Tape Ball Grid Array
Enhanced Ball Grid Array
Flip Chip Ball Grid Array
Micro BGA

Segmentation by application
Consumer Electronics
Communications Industrial
Industrial
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Samsung Electro-Mechanics
Nanya PCB
TTM Technologies Inc.
Unimicron
Shennan Circuits
CMK Corporation
Kingboard
Creative Hi-tech Ltd.
Mer-Mar Electronics
JHYPCB
Multi Circuit Boards Ltd.
PCBAStore
Sierra Circuits
Cirexx
Pcbcart
RayMing
UCREATE ELECTRONIC GROUP

Key Questions Addressed in this Report

What is the 10-year outlook for the global Ball Grid Array (BGA) PCB market?

What factors are driving Ball Grid Array (BGA) PCB market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Ball Grid Array (BGA) PCB market opportunities vary by end market size?

How does Ball Grid Array (BGA) PCB break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.