Global Backside Grinding Tape Market Growth 2023-2029

Global Backside Grinding Tape Market Growth 2023-2029

Backside Grinding Tape is a tape used to protect the surface of the wafer during back grinding after the IC circuit is formed on the wafer. It is pasted on the circuit surface to prevent damage to the circuit surface and contamination of the wafer surface, and plays a role in improving the precision of wafer grinding. The physical and chemical properties are particularly excellent, and the wafer patterns and chips are perfectly protected during the process.
LPI (LP Information)' newest research report, the “Backside Grinding Tape Industry Forecast” looks at past sales and reviews total world Backside Grinding Tape sales in 2022, providing a comprehensive analysis by region and market sector of projected Backside Grinding Tape sales for 2023 through 2029. With Backside Grinding Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Backside Grinding Tape industry.
This Insight Report provides a comprehensive analysis of the global Backside Grinding Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Backside Grinding Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Backside Grinding Tape market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Backside Grinding Tape and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Backside Grinding Tape.
The global Backside Grinding Tape market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.
United States market for Backside Grinding Tape is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
China market for Backside Grinding Tape is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Europe market for Backside Grinding Tape is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Global key Backside Grinding Tape players cover Furukawa Electric, LG Chem, Nitto Denko, Mitsui Chemicals, LINTEC, Denka, AI Technology, DSK Technologies and Minitron Elektronik, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.
This report presents a comprehensive overview, market shares, and growth opportunities of Backside Grinding Tape market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
UV Type
Non-UV Type
Segmentation by application
Semiconductor Wafer
Semiconductor Chip
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Furukawa Electric
LG Chem
Nitto Denko
Mitsui Chemicals
LINTEC
Denka
AI Technology
DSK Technologies
Minitron Elektronik
Disco Corporation
Fine Technology
AMC Co Ltd
Toyo Adtec
Force-One Applied Materials
Key Questions Addressed in this Report
What is the 10-year outlook for the global Backside Grinding Tape market?
What factors are driving Backside Grinding Tape market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Backside Grinding Tape market opportunities vary by end market size?
How does Backside Grinding Tape break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.