Global BGA Solder Ball Market Growth 2025-2031

The global BGA Solder Ball market size is predicted to grow from US$ 232 million in 2025 to US$ 382 million in 2031; it is expected to grow at a CAGR of 8.6% from 2025 to 2031.

Global key players of BGA Solder Ball include Senju Metal, DS HiMetal, Accurus, etc. The top three players hold a share about 63%. Asia-Pacific is the largest market, and has a share about 87%, followed by North America and Europe with share 6% and 5%, separately. In terms of product type, Lead-Free Solder Balls is the largest segment, accounting for a share of 73%. In terms of application, PBGA is the largest field with a share about 58 percent.

LP Information, Inc. (LPI) ' newest research report, the “BGA Solder Ball Industry Forecast” looks at past sales and reviews total world BGA Solder Ball sales in 2024, providing a comprehensive analysis by region and market sector of projected BGA Solder Ball sales for 2025 through 2031. With BGA Solder Ball sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world BGA Solder Ball industry.

This Insight Report provides a comprehensive analysis of the global BGA Solder Ball landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on BGA Solder Ball portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global BGA Solder Ball market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for BGA Solder Ball and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global BGA Solder Ball.

This report presents a comprehensive overview, market shares, and growth opportunities of BGA Solder Ball market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Lead-Free Solder Balls
Lead Solder Balls

Segmentation by Application:
PBGA
FCBGA
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Senju Metal
DS HiMetal
Accurus
Nippon Micrometal
MK Electron
PhiChem
Shenmao Technology
TK material
Fonton Industrial

Key Questions Addressed in this Report

What is the 10-year outlook for the global BGA Solder Ball market?

What factors are driving BGA Solder Ball market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do BGA Solder Ball market opportunities vary by end market size?

How does BGA Solder Ball break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.