Global Automatic Wafer Thinning Machine Market Growth 2025-2031

The global Automatic Wafer Thinning Machine market size is predicted to grow from US$ 913 million in 2025 to US$ 2319 million in 2031; it is expected to grow at a CAGR of 16.8% from 2025 to 2031.

Wafer thinning refers to the reduction of the size of the wafer in the production of integrated circuits. In order to produce more complex mechanical equipment for integrated circuits, it can be divided into fully automatic and semi-automatic according to the degree of automation. This report studies the fully automatic wafer thinning machine.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

LP Information, Inc. (LPI) ' newest research report, the “Automatic Wafer Thinning Machine Industry Forecast” looks at past sales and reviews total world Automatic Wafer Thinning Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Automatic Wafer Thinning Machine sales for 2025 through 2031. With Automatic Wafer Thinning Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Automatic Wafer Thinning Machine industry.

This Insight Report provides a comprehensive analysis of the global Automatic Wafer Thinning Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Automatic Wafer Thinning Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Automatic Wafer Thinning Machine market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Automatic Wafer Thinning Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Automatic Wafer Thinning Machine.

This report presents a comprehensive overview, market shares, and growth opportunities of Automatic Wafer Thinning Machine market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
4000RPM
4000-6000RPM
Above 6000RPM

Segmentation by Application:
8 Inches Wafer (200mm)
12 Inches Wafer (300mm)
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Disco
Tokyo Precision
G&N
Okamoto Semiconductor Equipment Division
Beijing CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machinery
SpeedFam
Huahai Qingke
Beijing TSD Semiconductor

Key Questions Addressed in this Report

What is the 10-year outlook for the global Automatic Wafer Thinning Machine market?

What factors are driving Automatic Wafer Thinning Machine market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Automatic Wafer Thinning Machine market opportunities vary by end market size?

How does Automatic Wafer Thinning Machine break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.