Global Automatic Flip Chip Bonders Market Growth 2025-2031

The global Automatic Flip Chip Bonders market size is predicted to grow from US$ 254 million in 2025 to US$ 358 million in 2031; it is expected to grow at a CAGR of 5.9% from 2025 to 2031.

Flip chip die attach is a method for making electrical connections to a chip, where the chip is inverted and its bond pads are connected to a corresponding pattern of bond pads on a substrate.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

LP Information, Inc. (LPI) ' newest research report, the “Automatic Flip Chip Bonders Industry Forecast” looks at past sales and reviews total world Automatic Flip Chip Bonders sales in 2024, providing a comprehensive analysis by region and market sector of projected Automatic Flip Chip Bonders sales for 2025 through 2031. With Automatic Flip Chip Bonders sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Automatic Flip Chip Bonders industry.

This Insight Report provides a comprehensive analysis of the global Automatic Flip Chip Bonders landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Automatic Flip Chip Bonders portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Automatic Flip Chip Bonders market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Automatic Flip Chip Bonders and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Automatic Flip Chip Bonders.

This report presents a comprehensive overview, market shares, and growth opportunities of Automatic Flip Chip Bonders market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Fully Automatic
Semi-Automatic

Segmentation by Application:
Industrial
Construction
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
BESI
ASMPT
Muehlbauer
K&S
Hamni
SET
Athlete FA
Toray
HiSOL
Advanced Techniques
Finetech
Yamaha Motor

Key Questions Addressed in this Report

What is the 10-year outlook for the global Automatic Flip Chip Bonders market?

What factors are driving Automatic Flip Chip Bonders market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Automatic Flip Chip Bonders market opportunities vary by end market size?

How does Automatic Flip Chip Bonders break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.