Global Au-Sn Solder Paste Market Growth 2025-2031

Global Au-Sn Solder Paste Market Growth 2025-2031

The global Au-Sn Solder Paste market size is predicted to grow from US$ 51.6 million in 2025 to US$ 59.8 million in 2031; it is expected to grow at a CAGR of 2.5% from 2025 to 2031.

Au-Sn solder paste is generally used in applications that require a high melting temperature (over 150°C), good thermal fatigue properties, and high-temperature strength. It is also used in applications that require a high tensile strength and high corrosive resistance, or in step soldering applications where the paste will not melt during a subsequent low-temperature reflow process.

Global key Au-Sn solder paste players include Mitsubishi Materials, Indium Corporation and AIM Solder etc. The top 3 companies hold a share about 79%. North America is the largest market with a share about 43%, followed by Japan and China. In terms of product, Au80Sn20product is the largest segment with a share about 64%. And in terms of applications, the largest application is radio frequency devices with a share about 41%.

LP Information, Inc. (LPI) ' newest research report, the “Au-Sn Solder Paste Industry Forecast” looks at past sales and reviews total world Au-Sn Solder Paste sales in 2024, providing a comprehensive analysis by region and market sector of projected Au-Sn Solder Paste sales for 2025 through 2031. With Au-Sn Solder Paste sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Au-Sn Solder Paste industry.

This Insight Report provides a comprehensive analysis of the global Au-Sn Solder Paste landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Au-Sn Solder Paste portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Au-Sn Solder Paste market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Au-Sn Solder Paste and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Au-Sn Solder Paste.

This report presents a comprehensive overview, market shares, and growth opportunities of Au-Sn Solder Paste market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Au80Sn20
Au78Sn22
Others

Segmentation by Application:
Radio Frequency Devices
Opto-electronic Devices
SAW (Surface Acoustic Waves) Filter
Quartz Oscillator
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsubishi Materials Corporation
Indium Corporation
AIM Solder
Chengdu Apex New Materials Co., Ltd.
Guangzhou Xianyi Electronic Technology Co.,Ltd.
Shenzhen Fuyingda Industry Technology Co., Ltd.

Key Questions Addressed in this Report

What is the 10-year outlook for the global Au-Sn Solder Paste market?

What factors are driving Au-Sn Solder Paste market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Au-Sn Solder Paste market opportunities vary by end market size?

How does Au-Sn Solder Paste break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.