Global Advanced Semiconductor Packaging Market Growth 2025-2031

Global Advanced Semiconductor Packaging Market Growth 2025-2031

The global Advanced Semiconductor Packaging market size is predicted to grow from US$ 17700 million in 2025 to US$ 27740 million in 2031; it is expected to grow at a CAGR of 7.8% from 2025 to 2031.

Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.

Top 5 manufacturers accounted for 43.06% market share in 2019.

LP Information, Inc. (LPI) ' newest research report, the “Advanced Semiconductor Packaging Industry Forecast” looks at past sales and reviews total world Advanced Semiconductor Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Advanced Semiconductor Packaging sales for 2025 through 2031. With Advanced Semiconductor Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Advanced Semiconductor Packaging industry.

This Insight Report provides a comprehensive analysis of the global Advanced Semiconductor Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Advanced Semiconductor Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Advanced Semiconductor Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Advanced Semiconductor Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Advanced Semiconductor Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Advanced Semiconductor Packaging market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Others

Segmentation by Application:
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Amkor
SPIL
Intel Corp
JCET
ASE
TFME
TSMC
Huatian
Powertech Technology Inc
UTAC
Nepes
Walton Advanced Engineering
Kyocera
Chipbond
Chipmos

Key Questions Addressed in this Report

What is the 10-year outlook for the global Advanced Semiconductor Packaging market?

What factors are driving Advanced Semiconductor Packaging market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Advanced Semiconductor Packaging market opportunities vary by end market size?

How does Advanced Semiconductor Packaging break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.