Global Advanced Packaging Technologies Market Growth (Status and Outlook) 2023-2029

Global Advanced Packaging Technologies Market Growth (Status and Outlook) 2023-2029

During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.

LPI (LP Information)' newest research report, the “Advanced Packaging Technologies Industry Forecast” looks at past sales and reviews total world Advanced Packaging Technologies sales in 2022, providing a comprehensive analysis by region and market sector of projected Advanced Packaging Technologies sales for 2023 through 2029. With Advanced Packaging Technologies sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Advanced Packaging Technologies industry.

This Insight Report provides a comprehensive analysis of the global Advanced Packaging Technologies landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Advanced Packaging Technologies portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Advanced Packaging Technologies market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Advanced Packaging Technologies and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Advanced Packaging Technologies.

The global Advanced Packaging Technologies market size is projected to grow from US$ 14560 million in 2022 to US$ 22980 million in 2029; it is expected to grow at a CAGR of 6.7% from 2023 to 2029.

ASE, Amkor, SPIL, Stats Chippac, PTI, JCET, J-Devices, UTAC, Chipmos, Chipbond, STS, Huatian, NFM, Carsem, Walton, Unisem, OSE, AOI, Formosa and NEPES are the key manufacturters of Advanced Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Advanced Packaging Technologies market by product type, application, key players and key regions and countries.

Market Segmentation:

Segmentation by type
Active Packaging
Smart and Intelligent Packaging

Segmentation by application
Food
Beverages
Pharmaceuticals
Industrial & Chemicals
Cosmetics & Personal Care
Agriculture
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Toppan Printing Co. Ltd
Dai Nippon Printing
Amcor
Ultimet Films Limited
DuPont Teijin Films
Toray Advanced Film
Mitsubishi PLASTICS
Toyobo
Schur Flexibles Group
Sealed Air
Mondi
Wipak
3M
QIKE
Berry Plastics
Taghleef Industries
Fraunhofer POLO
Sunrise
JBF RAK

Please note: The report will take approximately 2 business days to prepare and deliver.