Global Advanced Packaging Materials Market Growth 2024-2030

Global Advanced Packaging Materials Market Growth 2024-2030

The global Advanced Packaging Materials market size is projected to grow from US$ 14560 million in 2023 to US$ 22060 million in 2030; it is expected to grow at a CAGR of 6.1% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Advanced Packaging Materials Industry Forecast” looks at past sales and reviews total world Advanced Packaging Materials sales in 2023, providing a comprehensive analysis by region and market sector of projected Advanced Packaging Materials sales for 2024 through 2030. With Advanced Packaging Materials sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Advanced Packaging Materials industry.

This Insight Report provides a comprehensive analysis of the global Advanced Packaging Materials landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Advanced Packaging Materials portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Advanced Packaging Materials market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Advanced Packaging Materials and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Advanced Packaging Materials.

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

This report presents a comprehensive overview, market shares, and growth opportunities of Advanced Packaging Materials market by product type, application, key manufacturers and key regions and countries.

Segmentation by type
Silicon Carbide (SiC)
Aluminum nitride (AlN)
Aluminum Silicon Carbide (AlSiC)
Others

Segmentation by application
Power Amplifier
Microwave Electronics
Thyristor
IGBT
MOSFET
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Saint-Gobain
Lanzhou Heqiao Resource Co., Ltd.
Cumi Murugappa
Elsid S.A
Washington Mills
ESD-SIC
Denka
CPS Technologies
Hunan Harvest Technology Development Company, Ltd
Beijing Baohang Advanced Material Co., Ltd.
Xi'an Mingke
Hunan Everrich Composite Corp.
Ceramtec
DWA Aluminum Composite
Thermal Transfer Composites
Japan Fine Ceramic
Sumitomo Electric

Key Questions Addressed in this Report

What is the 10-year outlook for the global Advanced Packaging Materials market?

What factors are driving Advanced Packaging Materials market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Advanced Packaging Materials market opportunities vary by end market size?

How does Advanced Packaging Materials break out type, application?

Please note: The report will take approximately 2 business days to prepare and deliver.