Global Advanced Packaging Market Growth 2023-2029

Global Advanced Packaging Market Growth 2023-2029

During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.

LPI (LP Information)' newest research report, the “Advanced Packaging Industry Forecast” looks at past sales and reviews total world Advanced Packaging sales in 2022, providing a comprehensive analysis by region and market sector of projected Advanced Packaging sales for 2023 through 2029. With Advanced Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Advanced Packaging industry.

This Insight Report provides a comprehensive analysis of the global Advanced Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Advanced Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Advanced Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Advanced Packaging and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Advanced Packaging.

The global Advanced Packaging market size is projected to grow from US$ 14560 million in 2022 to US$ 22980 million in 2029; it is expected to grow at a CAGR of 22980 from 2023 to 2029.

ASE, Amkor, SPIL, Stats Chippac, PTI, JCET, J-Devices, UTAC, Chipmos, Chipbond, STS, Huatian, NFM, Carsem, Walton, Unisem, OSE, AOI, Formosa and NEPES are the key manufacturters of Advanced Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Advanced Packaging market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type

3.0 DIC

FO SIP

FO WLP

3D WLP

WLCSP

2.5D

Filp Chip

Segmentation by application

Analog & Mixed Signal

Wireless Connectivity

Optoelectronic

MEMS & Sensor

Misc Logic and Memory

Other

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.

ASE

Amkor

SPIL

Stats Chippac

PTI

JCET

J-Devices

UTAC

Chipmos

Chipbond

STS

Huatian

NFM

Carsem

Walton

Unisem

OSE

AOI

Formosa

NEPES

Key Questions Addressed in this Report

What is the 10-year outlook for the global Advanced Packaging market?

What factors are driving Advanced Packaging market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Advanced Packaging market opportunities vary by end market size?

How does Advanced Packaging break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.