Global Adhesives for Electronics Assembly Market Growth 2023-2029

Global Adhesives for Electronics Assembly Market Growth 2023-2029

Electronic adhesives are made from the raw material such as epoxies, silicones, cyanoacrylates, polyurethanes, and polysulfides. They are the part of the electronic components, which is utilized in the assembly and manufacture of electronic circuits and products.

LPI (LP Information)' newest research report, the “Adhesives for Electronics Assembly Industry Forecast” looks at past sales and reviews total world Adhesives for Electronics Assembly sales in 2022, providing a comprehensive analysis by region and market sector of projected Adhesives for Electronics Assembly sales for 2023 through 2029. With Adhesives for Electronics Assembly sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Adhesives for Electronics Assembly industry.

This Insight Report provides a comprehensive analysis of the global Adhesives for Electronics Assembly landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Adhesives for Electronics Assembly portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Adhesives for Electronics Assembly market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Adhesives for Electronics Assembly and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Adhesives for Electronics Assembly.

The global Adhesives for Electronics Assembly market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.

United States market for Adhesives for Electronics Assembly is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

China market for Adhesives for Electronics Assembly is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Europe market for Adhesives for Electronics Assembly is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Global key Adhesives for Electronics Assembly players cover 3M, Arkema, Parker Hannifin Corporation, H.B. Fuller, DELO Industrial Adhesives, Panacol-Elosol GmbH, ITW, Dow and Huntsman, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.

This report presents a comprehensive overview, market shares, and growth opportunities of Adhesives for Electronics Assembly market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
Liquid
Paste
Solid

Segmentation by application
Consumer Electronics
Industrial
Medical
Transportation
Aviation and Defense
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
3M
Arkema
Parker Hannifin Corporation
H.B. Fuller
DELO Industrial Adhesives
Panacol-Elosol GmbH
ITW
Dow
Huntsman
Hexion
Meridian Adhesives Group
Sika Group
Permabond
Dymax
Panasonic Electronic
ALTANA AG
Bondline
Boyd Corporation
Wacker Chemie AG
Rogers Corporation
Momentive
ThreeBond Group
Master Bond
Scapa Industrial
Xiamen Weldbond New Material

Key Questions Addressed in this Report

What is the 10-year outlook for the global Adhesives for Electronics Assembly market?

What factors are driving Adhesives for Electronics Assembly market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Adhesives for Electronics Assembly market opportunities vary by end market size?

How does Adhesives for Electronics Assembly break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.